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ST0280 Iron (II) Sulfide Sputtering Target, FeS

Chemical Formula: FeS
Catalog Number: ST0280
CAS Number: 1317-37-9
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Iron Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Iron Sulfide Sputtering Target Description

Iron sulfide sputtering target is a ceramic sputtering material composed of iron and sulfur. It is commonly used in various applications, including thin film deposition, semiconductor manufacturing, display technologies, and more. The iron sulfide composition provides specific properties that are useful in these industries, such as electrical conductivity and catalytic activity.

ironIron, known by its symbol “Fe” from the Latin word “ferrum,” is a chemical element with atomic number 26. It is part of the d-block of the periodic table, situated in Period 4 and Group 8. Iron has been used since before 5000 BC, playing a crucial role in the development of human civilization. The relative atomic mass of iron is approximately 55.845(2) Dalton, with the value in brackets representing the measurement uncertainty.

Related Product: Iron Sputtering Target

SulfurSulfur, also known as sulphur, is a chemical element with the symbol “S” and atomic number 16. Its name originates from the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium,’ both referring to the substance. Sulfur has been in use since before 2000 BC and was discovered by ancient Chinese and Indian civilizations. In the periodic table, sulfur is located in Period 3, Group 16, within the p-block. Its relative atomic mass is approximately 32.065(5) Dalton, with the value in brackets indicating the uncertainty of the measurement.

Iron Sulfide Sputtering Target Specification

Compound FormulaFeS
AppearanceSolid
Melting Point1194 °C
Density4.75- 4.84 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Iron Sulfide Sputtering Target Application

The iron sulfide sputtering target is utilized in various applications, including thin film deposition for decoration, semiconductors, displays, LEDs, and photovoltaic devices. It is also used in functional coatings and is suitable for optical information storage industries, as well as glass coating industries, such as those involved in car glass and architectural glass. Additionally, it finds applications in optical communication technologies.

Iron Sulfide Sputtering Target Packing

Our iron sulfide sputter targets are carefully tagged and labeled externally for easy identification and stringent quality control. We take great care to prevent any damage during storage and transportation, ensuring the product arrives in optimal condition.

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TFM offers Iron Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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