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VD0628 Iron Manganese Evaporation Materials, Fe/Mn

Catalog No.VD0628
MaterialIron Manganese (Fe/Mn)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in the production of high-purity iron manganese evaporation materials, utilizing stringent quality assurance processes to ensure reliable performance. We offer these materials in a variety of forms, including tablets, granules, pellets, and powder, to accommodate different application requirements.

MSDS File

Iron Manganese Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) provides high-purity iron manganese evaporation materials, an alloy of iron (Fe) and manganese (Mn). These materials are essential for achieving high-quality films in various deposition processes. Our iron manganese evaporation materials are produced with up to 99.9995% purity, backed by rigorous quality assurance to ensure consistent performance and reliability.

Applications of Iron Manganese Evaporation Materials

Iron manganese evaporation materials are used in numerous applications, including:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

We ensure that our iron manganese evaporation materials are carefully handled and packaged to prevent any damage during storage and transportation, preserving the integrity of the products.

Contact Us

At TFM, we are a leading manufacturer and supplier of high-purity iron manganese evaporation materials, as well as a range of other evaporation products. Our materials are available in powder and granule forms, with custom options upon request. For current pricing and information on additional deposition materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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