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VD0629 Iron Nickel Evaporation Materials, Fe/Ni

Catalog No.VD0629
MaterialIron Nickel (Fe/Ni)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) excels in manufacturing high-purity iron nickel evaporation materials, employing rigorous quality assurance processes to ensure exceptional product reliability. We provide these materials in various forms, including tablets, granules, pellets, and powder, to meet a wide range of application requirements.

MSDS File

Iron Nickel Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) offers high-purity iron nickel evaporation materials, an alloy consisting of iron (Fe) and nickel (Ni). These materials are crucial for achieving high-quality films in various deposition processes. With purity levels up to 99.9995%, our iron nickel evaporation materials are produced with stringent quality assurance measures to ensure exceptional performance and reliability.

Applications of Iron Nickel Evaporation Materials

Iron nickel evaporation materials are used in a range of applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Utilized in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

We meticulously handle and package our iron nickel evaporation materials to prevent any damage during storage and transportation, ensuring the products remain in their original, high-quality condition.

Contact Us

At TFM, we are a leading manufacturer and supplier of high-purity iron nickel evaporation materials and a variety of other evaporation products. Our materials are available in powder and granule forms, with customized options upon request. For current pricing and details on additional deposition materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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