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VD0751 Iron Nitride Evaporation Materials, FeN4

Catalog No.VD0751
MaterialIron Nitride (FeN4)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM excels as a premier manufacturer and supplier of high-purity Iron Nitride evaporation materials, along with a broad selection of other evaporation products. Our Iron Nitride materials are available in both powder and granule forms, with options for custom configurations to suit your specific requirements. TFM is dedicated to delivering exceptional quality and reliability in every product we offer.

MSDS File
Iron Nitride Evaporation Materials Overview

Iron Nitride evaporation materials are essential for high-quality film deposition, providing excellent performance in various deposition techniques. These materials, with the chemical formula FeN4, are renowned for their high purity and effectiveness in producing superior thin films. TFM offers Iron Nitride evaporation materials with exceptional purity, up to 99.9995%, ensuring reliable and consistent results.

Key Specifications

Material TypeIron Nitride
SymbolFeN4
Appearance/ColorGray Solid
Melting PointN/A
Density7.95 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Iron Nitride evaporation materials are used in a variety of applications, including:

  • Deposition Processes: Vital for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics and Coatings: Suitable for wear protection, decorative coatings, and displays.

Packaging and Handling

Our Iron Nitride evaporation materials are meticulously packaged and labeled to ensure easy identification and maintain quality. We take great care to prevent any damage during storage and transportation.

Contact Us

TFM is a leading manufacturer and supplier of high-purity Iron Nitride evaporation materials. We provide various shapes, including tablets, granules, rods, and wires, with custom forms and quantities available upon request. Additionally, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about other materials, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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