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ST0156A Iron Oxide Sputtering Targets

Material TypeIron Oxide
SymbolFe3O4
Color/AppearanceBlack
Melting Point (°C)1597
Density5.17 g/cm3
Molecular Weight231.63
Sputter
Exact Mass233.7

Introduction

Iron Oxide Sputtering Targets are ceramic compound targets widely used in thin film deposition processes for producing magnetic, electronic, and optical oxide coatings. Iron oxides exist in several crystalline forms—including Fe₂O₃ (hematite), Fe₃O₄ (magnetite), and FeO—each offering distinct electrical, magnetic, and catalytic properties.

These targets are commonly employed in magnetron sputtering systems to deposit functional oxide thin films used in sensors, magnetic devices, photocatalytic coatings, and semiconductor research. Due to their tunable magnetic behavior and chemical stability, iron oxide thin films are important materials in both industrial applications and advanced materials science.

Detailed Description

Iron Oxide sputtering targets are manufactured from high-purity iron oxide powders using advanced ceramic processing methods such as vacuum sintering, hot pressing, or hot isostatic pressing (HIP). These processes produce dense targets with homogeneous microstructures and controlled stoichiometry, which are critical for stable sputtering performance and uniform thin film deposition.

Different iron oxide phases offer different material characteristics:

  • Fe₂O₃ (Hematite) – a stable oxide with semiconducting properties and strong chemical stability

  • Fe₃O₄ (Magnetite) – a ferrimagnetic oxide with high electrical conductivity compared to other oxides

  • FeO (Wüstite) – less commonly used but important in specialized oxide studies

Iron oxide thin films deposited from sputtering targets exhibit properties such as magnetic behavior, catalytic activity, optical absorption, and electrical conductivity, depending on the oxide phase and deposition conditions.

High-density sputtering targets help maintain stable sputtering rates and minimize particle generation. For high-power sputtering systems, iron oxide targets can be supplied as bonded targets with copper backing plates, typically using indium bonding to improve heat dissipation and mechanical stability during deposition.

Applications

Iron Oxide sputtering targets are used in many advanced technology fields:

  • Magnetic thin films used in spintronic devices and magnetic sensors

  • Gas sensing materials for environmental monitoring systems

  • Photocatalytic coatings used in environmental purification technologies

  • Semiconductor oxide research involving functional metal oxides

  • Electrochemical devices including battery and energy storage materials

  • Optical and decorative coatings requiring stable oxide layers

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures stable thin film composition
Chemical CompositionFe₂O₃ / Fe₃O₄ / FeODetermines magnetic and electrical behavior
Diameter25 – 300 mm (custom)Compatible with various sputtering systems
Thickness3 – 6 mmInfluences sputtering efficiency and target life
Density≥ 95% theoretical densityEnsures stable sputtering and uniform film deposition
BondingCopper backing plate / Indium bondedImproves heat transfer during sputtering

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Iron Oxide (Fe₂O₃ / Fe₃O₄)Magnetic and catalytic oxide propertiesSensors and magnetic thin films
Nickel Oxide (NiO)Good electrochemical performanceBatteries and electrochromic devices
Cobalt Oxide (Co₃O₄)Strong catalytic activityCatalysis and energy storage

FAQ

QuestionAnswer
What types of iron oxide sputtering targets are available?Common options include Fe₂O₃ (hematite), Fe₃O₄ (magnetite), and other customized iron oxide compositions.
What sputtering methods are suitable for iron oxide targets?RF magnetron sputtering is typically used for ceramic oxide targets.
Can the target size be customized?Yes. Diameter, thickness, and bonding configurations can be tailored to match specific sputtering systems.
Are bonded sputtering targets available?Yes. Iron oxide targets can be bonded to copper backing plates using indium bonding for improved thermal management.
What substrates can iron oxide thin films be deposited on?Films can be deposited on silicon wafers, glass, ceramics, and metallic substrates.

Packaging

Our Iron Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. Each target is packaged in vacuum-sealed bags with protective foam materials and export-grade cartons or wooden crates to prevent contamination, oxidation, and mechanical damage during storage and transportation.

Conclusion

Iron Oxide Sputtering Targets provide a reliable material solution for depositing functional oxide thin films with magnetic, electronic, and catalytic properties. Their versatility makes them suitable for a wide range of applications, including sensors, magnetic devices, photocatalysis, and advanced oxide electronics.

With customizable compositions, high-density ceramic manufacturing, and stable sputtering performance, iron oxide sputtering targets support both industrial coating processes and cutting-edge materials research.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

FeO target 3N ø50.8×3.18mm Cu BP, Ø1" × 6.35 mm, Iron Oxide, 3N, Ø2" × 3.18 mm, Iron Oxide, 3N, Ø2" × 6.35 mm, Iron Oxide, 3N, Ø3" × 3.18 mm, Iron Oxide, 3N

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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