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ST0156A Iron Oxide Sputtering Targets (Fe3O4)

MSDS File
Material TypeIron Oxide
SymbolFe3O4
Color/AppearanceBlack
Melting Point (°C)1597
Density5.17 g/cm3
Molecular Weight231.63
Sputter
Exact Mass233.7

Iron Oxide Sputtering Targets

Iron oxides are chemical compounds formed by the combination of iron and oxygen. There are a total of sixteen distinct iron oxides and oxyhydroxides, each playing a significant role in various geological and biological processes. These compounds are abundant in nature and have numerous industrial applications. Examples include their use as iron ores, pigments, catalysts, in thermite reactions, and in hemoglobin. One well-known form of iron oxide is rust, specifically iron(III) oxide.

Iron oxides are particularly popular in the manufacturing of affordable, durable pigments for use in paints, coatings, and colored concretes. These pigments typically come in hues from the yellow/orange/red/brown/black spectrum and are commonly referred to as “Earth” colors. When used as a food coloring agent, iron oxide is designated as E172.

Iron Oxide Sputtering Targets Overview

Purity: 99.99%
Available Shapes:

  • Circular: Diameter ≤ 14 inches, Thickness ≥ 1mm
  • Block: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1mm

Iron Oxide Sputtering Targets Applications

  • Ferroelectric
  • Gate Dielectric
  • For CMOS Technology

Features of Iron Oxide Sputtering Targets

  • High Purity: 99.99% minimum purity ensures superior performance.
  • Custom Sizes: Available upon request for specific needs.

Manufacturing Process

  1. Cold Pressing – The initial step in shaping the material.
  2. Sintering – Enhances density and material integrity.
  3. Elastomer Bonding – Bonds the target to the backing plate.
  4. Cleaning and Packaging – Thoroughly cleaned to ensure readiness for use in vacuum environments.
  5. Environmental Protection – The targets are carefully shielded from contaminants during shipment.

Additional Options

  • Purity: 99.99% minimum, ensuring excellent consistency and reliability.
  • Custom Sizes: Smaller sizes are available for research and development applications.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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