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ST0334 ITO Sputtering Target, Indium Tin Oxide

Catalog No.: ST0334
Material: Indium Tin Oxide, ITO
Purity: >=99.99%
CAS Number: 50926-11-9
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Indium Tin Oxide (ITO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

ITO Sputtering Target Description

ITO TargetITO Sputtering Target from TFM is a ceramic sputtering material made of indium tin oxide. Indium tin oxide (ITO) is a solid solution of indium oxide (In2O3) and tin oxide (SnO2), typically composed of 90% In2O3 and 10% SnO2 by weight. ITO is one of the most widely used transparent conducting oxides due to its excellent electrical conductivity and optical transparency. Thin films of indium tin oxide are most commonly deposited on surfaces by physical vapor deposition (PVD).

ITO Sputtering Target Specification

Material TypeIndium Tin Oxide
SymbolITO
Color/AppearancePale yellow to greenish yellow
Melting Point1,800°C
Density7.14 g/m3
SputterRF, DC
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

ITO Sputtering Target Application

ITO Sputtering Targets are used for ITO-coated substrates, including electrodes for flat panel displays, touch panel contacts, energy-saving automobile and building window glass coatings, optoelectronic devices, solar cells, and more. TFM provides high-purity and high-density ITO targets in various dimensions to meet the specific needs of our customers.

ITO Sputtering Target Bonding Services

Specialized bonding services for ITO Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Our Indium Tin Oxide (ITO) Sputtering Targets are carefully handled to prevent damage during storage and transportation, ensuring the quality of our products is preserved in their original condition.

Get Contact

TFM offers Indium Tin Oxide (ITO) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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