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ST0334 ITO Sputtering Target, Indium Tin Oxide

Catalog No.: ST0334
Material: Indium Tin Oxide, ITO
Purity: >=99.99%
CAS Number: 50926-11-9
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Indium Tin Oxide (ITO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Indium Tin Oxide (ITO) Sputtering Target

Introduction

The Indium Tin Oxide (ITO) Sputtering Target is one of the most widely used transparent conductive oxide (TCO) materials for thin film deposition. Composed of indium oxide (In₂O₃) and tin oxide (SnO₂), typically in a 90:10 weight ratio, ITO combines excellent optical transparency with high electrical conductivity. It is indispensable in manufacturing displays, touch panels, solar cells, and optoelectronic devices.

Detailed Description

ITO is a degenerate n-type semiconductor that exhibits both metallic and dielectric properties. Its unique combination of ~85–90% optical transparency and low resistivity (10⁻⁴–10⁻³ Ω·cm) allows it to serve as an electrode material in various optical and electronic devices.

ITO sputtering targets are manufactured through hot pressing, vacuum sintering, or cold isostatic pressing (CIP) to achieve high density and chemical uniformity. The dense structure ensures stable sputtering behavior, low particle generation, and excellent film uniformity on both glass and polymer substrates.

Key Features:

  • High transparency in visible light and infrared reflection capability.

  • Low electrical resistivity for efficient current conduction.

  • Stable film performance under high temperature and plasma conditions.

  • Custom compositions available (e.g., In₂O₃:SnO₂ = 90:10, 95:5, or 80:20 wt%).

  • Suitable for both DC and RF magnetron sputtering.

Applications

ITO sputtering targets are used extensively in:

  • Flat-panel displays (FPD, OLED, LCD) – transparent electrodes.

  • Touchscreens and smart devices.

  • Photovoltaic cells – front transparent conductive layers.

  • Optoelectronic devices – LEDs, sensors, and electrochromic windows.

  • Architectural and automotive glass coatings – energy-saving low-E films.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical Formula(In₂O₃)₁₋ₓ(SnO₂)ₓDefines transparency and conductivity
Composition RatioIn₂O₃:SnO₂ = 90:10 wt%Industry standard for TCO films
Purity99.9% – 99.99%Ensures low defect density
Density≥ 7.0 g/cm³Improves sputtering efficiency
Resistivity (film)10⁻⁴ – 10⁻³ Ω·cmProvides excellent conductivity
Diameter25 – 300 mm (custom)Fits various sputtering systems
Thickness3 – 10 mmBalances sputtering lifetime and uniformity
Backing PlateCopper / TitaniumImproves heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Indium Tin Oxide (ITO)Excellent transparency & conductivityDisplays, photovoltaics
Aluminum Zinc Oxide (AZO)Cost-effective TCO alternativeSolar cells
Fluorine-doped Tin Oxide (FTO)High thermal durabilityArchitectural glass
Indium Zinc Oxide (IZO)Enhanced flexibility & low-temp sputteringFlexible displays

FAQ

QuestionAnswer
Can the In₂O₃:SnO₂ ratio be customized?Yes, ratios like 95:5 or 80:20 wt% are available upon request.
What sputtering systems is ITO compatible with?Works with both DC and RF magnetron sputtering systems.
How is the target bonded?Typically with copper or titanium backplates for heat management.
What’s the typical film transparency?Over 85% in the visible range.
How are the targets packaged?Vacuum-sealed, foam-cushioned, and packed in export-grade crates.

Packaging

Each ITO Sputtering Target is vacuum-sealed in moisture-free packaging with desiccants and foam padding. All targets are labeled for traceability and shipped in shockproof, export-safe wooden crates to ensure safe transport.

Conclusion

The Indium Tin Oxide sputtering target is a benchmark material for transparent conductive films, combining superior conductivity, transparency, and process stability. It plays a critical role in modern optoelectronics, offering reliable and customizable performance for both industrial and research applications.

For detailed specifications and quotations, please contact us at [sales@thinfilmmaterials.com].

Order Now

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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