Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
🔍
lab6-removebg-preview

ST0295 Lanthanum Boride Sputtering Target, LaB6

Chemical Formula: LaB6
Catalog Number: ST0295
CAS Number: 12008-21-8
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Boride Sputtering Target Description

A Lanthanum Boride Sputtering Target is a type of ceramic material consisting of lanthanum and boron. This target is commonly used in sputtering processes for thin film deposition, benefiting from the unique properties of the lanthanum-boron composition.

LanthanumLanthanum is a soft, malleable, silvery-white metal and one of the most reactive rare earth elements. It is used in the production of special optical glasses and can enhance the malleability of steel. Additionally, lanthanum plays a crucial role in wastewater treatment and oil refining. Due to its use in photoconversion films, lanthanum has been nicknamed “super calcium” by scientists.

Related Product: Lanthanum Sputtering Target

BoronBoron, represented by the chemical symbol “B” and atomic number 5, derives its name from the Arabic word ‘buraq,’ referring to borax. It was first noted in 1808 by scientists Louis-Joseph Gay-Lussac and Louis-Jacques Thénard, with its isolation later achieved and announced by Sir Humphry Davy. Boron is found in Period 2 and Group 13 of the periodic table, classified within the p-block elements. Its relative atomic mass is approximately 10.811 Daltons, with the value in parentheses indicating a margin of uncertainty.

Related Product: Boron Sputtering Target

Lanthanum Boride Sputtering Target Specification

Material TypeLanthanum Hexaboride
SymbolLaB6
Melting Point2,210 °C
Density2.61 g/cm3
SputterRF
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lanthanum Boride Sputtering Target Bonding Services

Specialized bonding services for Lanthanum Boride Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Our Lanthanum Boride Sputtering Targets are meticulously tagged and labeled externally to ensure easy identification and maintain strict quality control standards. We take great care in handling these targets to prevent any potential damage during storage and transportation, ensuring they arrive in excellent condition.

Get Contact

TFM offers Lanthanum Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
en en