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ST0159A Lanthanum Calcium Manganate Sputtering Targets (La0.5Ca0.5MnO3)

Introduction

Lanthanum Calcium Manganate Sputtering Targets (La₀.₅Ca₀.₅MnO₃) are perovskite-structured oxide targets widely used in functional oxide thin-film research and advanced electronic applications. Known for their mixed ionic–electronic conductivity and strong correlation between electrical and magnetic properties, LCMO targets are essential materials for depositing high-quality films in spintronics, oxide electronics, and energy-related devices.

Detailed Description

Lanthanum Calcium Manganate (LCMO) is a doped manganite oxide where partial substitution of lanthanum with calcium precisely tunes the Mn³⁺/Mn⁴⁺ ratio. This compositional control directly influences electrical conductivity, magnetoresistance behavior, and phase stability of the deposited films.

Our La₀.₅Ca₀.₅MnO₃ sputtering targets are fabricated using high-purity precursor oxides, followed by controlled calcination, milling, and high-temperature sintering. This process ensures:

  • Single-phase perovskite structure, minimizing secondary phases

  • High density and uniform microstructure, supporting stable sputtering rates

  • Excellent stoichiometric transfer, critical for functional oxide thin films

Targets can be supplied as unbonded ceramic discs or bonded to metallic backing plates (such as copper or titanium) to enhance heat dissipation and mechanical stability during sputtering.

Applications

Lanthanum Calcium Manganate sputtering targets are widely used in:

  • Colossal magnetoresistance (CMR) thin films

  • Spintronic and magnetic oxide devices

  • Solid oxide fuel cell (SOFC) cathode research

  • Oxide electronics and resistive switching devices

  • Academic and industrial R&D on perovskite oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaLa₀.₅Ca₀.₅MnO₃Defines electrical and magnetic behavior
Crystal StructurePerovskite oxideEnsures functional oxide properties
Purity99.9% – 99.99%Reduces impurities affecting film performance
Diameter25 – 300 mm (custom)Compatible with common sputtering systems
Thickness3 – 6 mmInfluences sputtering stability and lifetime
Density≥ 95% theoreticalImproves sputtering uniformity
BondingOptional Cu / Ti backing plateEnhances thermal management

Comparison with Related Manganate Materials

MaterialKey AdvantageTypical Application
La₀.₅Ca₀.₅MnO₃Balanced conductivity & magnetoresistanceSpintronics, oxide electronics
La₀.₇Sr₀.₃MnO₃Higher Curie temperatureMagnetic sensors
LaMnO₃Strong antiferromagnetic behaviorFundamental research

FAQ

QuestionAnswer
Can the target composition be adjusted?Yes, Ca/La ratios can be customized upon request.
Is RF or DC sputtering recommended?RF sputtering is commonly used for oxide ceramic targets.
Can targets be bonded to backing plates?Yes, copper or titanium backing plates are available.
Are these targets suitable for research use?Yes, they are widely used in academic and industrial R&D.

Packaging

Our Lanthanum Calcium Manganate Sputtering Targets are individually labeled for full traceability and quality control. Each target is vacuum-sealed and packed with protective materials to prevent contamination or mechanical damage during storage and international transportation.

Conclusion

Lanthanum Calcium Manganate Sputtering Targets (La₀.₅Ca₀.₅MnO₃) provide reliable performance for depositing high-quality functional oxide thin films. With controlled stoichiometry, high density, and customizable configurations, they are well suited for advanced research and specialized industrial applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.*

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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