ST0915 Lanthanum Strontium Cobalt Iron Oxide Sputtering Target, LSCF

Chemical FormulaLiNiO2
Catalog No.ST0914
CAS Number12031-65-1
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Strontium Cobalt Iron Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Description

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target is a specialized material used in the sputter deposition process. This compound, part of the perovskite oxide family, is widely utilized in applications such as solid oxide fuel cells (SOFCs), oxygen permeation membranes, and related fields.

In sputtering, a technique for depositing thin films onto substrates, the target material is bombarded with high-energy ions. This bombardment causes atoms or molecules to be ejected from the target surface and deposit onto the substrate, forming a thin film.

Lanthanum Strontium Cobalt Iron Oxide (LSCF) is a mixed metal oxide that integrates lanthanum, strontium, cobalt, and iron in a precise ratio. Its composition is optimized for electronic and ionic conductivity, making it particularly effective as a cathode material in SOFCs.

Related Product: Lanthanum Strontium Chromate Sputtering Target, Lanthanum Strontium Copper Oxide Sputtering Target

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Specifications

Compound FormulaLaxSr1-xCoyFe1-yO3
Molecular Weight97.63
AppearanceGray Target
Melting Point>1000℃
Density
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Handling Notes

Indium bonding is recommended for Lanthanum Strontium Cobalt Iron Oxide Sputtering Targets due to the material’s characteristics, such as brittleness and low thermal conductivity, which are not ideal for sputtering. This material exhibits low thermal conductivity and is susceptible to thermal shock, making indium bonding a preferred choice to ensure stable performance and reliable deposition results.

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Application

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target is crucial for the fabrication of materials used in advanced energy and electronic devices. Its unique properties, including high electronic and ionic conductivity, make it ideal for applications such as solid oxide fuel cells (SOFCs) and other high-performance energy solutions.

Lanthanum Strontium Cobalt Iron Oxide Sputtering Target Packaging

Our Lanthanum Strontium Cobalt Iron Oxide Sputtering Targets are meticulously handled during storage and transportation to maintain the highest quality of our products in their original condition.

Get Contact

TFM offers Lanthanum Strontium Cobalt Iron Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0915 Lanthanum Strontium Cobalt Iron Oxide Sputtering Target, LSCF”

Your email address will not be published. Required fields are marked *

FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

Shopping Cart
Scroll to Top