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Lanthanum Copper Manganate Sputtering Target

ST0442 Lanthanum Copper Manganate Sputtering Target, La2CuMnO6

Chemical Formula: La2CuMnO6
Catalog Number: ST0442
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Copper Manganate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Copper Manganate Sputtering Target Description

Lanthanum copper manganate sputtering targets are made up of lanthanum, copper, manganese, and oxygen, with the chemical formula La2CuMnO6. These high-purity targets are essential in deposition processes to achieve high-quality films. At TFM, we specialize in producing sputtering targets with up to 99.9995% purity, employing rigorous quality assurance processes to ensure product reliability.

LanthanumCoppermanganeseOxygen

Related products: Lanthanum Sputtering Target, Copper Sputtering Target, Manganese Sputtering Target

Lanthanum Copper Manganate Sputtering Target Specification

Material Type Lanthanum Copper Manganate
Symbol La2CuMnO6
Color/Appearance Solid
Melting Point N/A
Density N/A
Type of Bond Elastomer, Indium
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Lanthanum Copper Manganate Sputtering Target Application

The lanthanum copper manganate sputtering target is utilized in various applications, including thin film deposition, decoration, semiconductors, displays, LEDs, and photovoltaic devices. It is also employed in functional coatings and several optical information storage industries. Additionally, it is used in glass coating for products such as car glass, architectural glass, and in optical communication technologies.

Lanthanum Copper Manganate Sputtering Target Packing

Our lanthanum copper manganate sputtering targets are meticulously tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation, preserving the quality and integrity of our products.

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TFM offers Lanthanum Copper Manganate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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