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VD0557 Lanthanum Evaporation Materials, La

Catalog No.VD0557
MaterialLanthanum (La)
Purity99.5% ~ 99.9%
ShapePowder/ Granule/ Custom-made

TFM is a leading producer and supplier of high-purity lanthanum evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, with customization options available to meet specific needs.

Lanthanum Evaporation Materials Description

Lanthanum, represented by the symbol La and atomic number 57, is a soft, ductile, silvery-white metal that tarnishes gradually when exposed to air. High-purity lanthanum evaporation materials are vital for achieving excellent results in deposition processes, contributing to the production of high-quality thin films. At TFM, we specialize in manufacturing lanthanum evaporation materials with purity levels reaching up to 99.9%, supported by rigorous quality assurance procedures to ensure product reliability.

lanthanum evaporation materials

Lanthanum Evaporation Materials Specification

Material TypeLanthanum
SymbolLa
Color/AppearanceSolid
Melting Point 927 °C
Density7.3 g/cc
Thermal Conductivity6.17 W/m.K
Coefficient of Thermal Expansion12.1 x 10-6/K
SynonymsLa Pellets, La Pieces, La Evaporation Pellet, Lanthanum Pellets, Lanthanum Pieces, Lanthanum Evaporation Pellet

Lanthanum Evaporation Materials Application

Lanthanum evaporation materials are used in various deposition processes, including semiconductor fabrication, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). These processes are essential for creating high-quality thin films for advanced technologies. In optics, lanthanum materials are employed for wear protection, decorative coatings, and enhancing display technologies.

Lanthanum Evaporation Materials Packaging

We meticulously manage our lanthanum evaporation materials to prevent any damage during storage and transportation, ensuring that their quality and original condition are maintained.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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