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Lanthanum Gallate Sputtering Target

ST0445 Lanthanum Gallate Sputtering Target, LaGaO3

Chemical Formula: LaGaO3
Catalog Number: ST0445
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Gallate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Lanthanum Gallate (LaGaO₃) Sputtering Target is a perovskite-type oxide material valued for its excellent ionic conductivity, thermal stability, and compatibility with complex oxide heterostructures. It is widely used in advanced thin film research, particularly in solid oxide fuel cells (SOFCs), oxide electronics, and functional oxide interfaces. As a sputtering target, LaGaO₃ enables controlled deposition of high-quality gallate-based thin films with well-defined composition and crystalline properties.

Detailed Description

Our Lanthanum Gallate Sputtering Targets are manufactured from high-purity LaGaO₃ ceramic powders synthesized with precise stoichiometric control. Maintaining the correct La:Ga ratio is critical, as deviations can directly affect ionic transport behavior, dielectric properties, and film crystallinity.

The targets are fabricated through optimized calcination and high-temperature sintering processes to achieve high density and uniform microstructure. A dense ceramic body reduces particle generation and improves plasma stability during RF sputtering, leading to smooth, compositionally uniform thin films. Targets are available in standard round or rectangular formats and can be supplied unbonded or bonded to metallic backing plates to enhance heat dissipation and mechanical stability in higher-power sputtering systems.

Applications

Lanthanum Gallate Sputtering Targets are commonly used in the following thin film applications:

  • Electrolyte and functional layers for solid oxide fuel cells (SOFCs)

  • Oxide ion–conducting thin films

  • Substrates and buffer layers for complex oxide heterostructures

  • Dielectric and insulating layers in oxide electronics

  • Functional coatings for sensors and energy devices

  • Academic and industrial R&D on perovskite oxides

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionLaGaO₃Determines ionic and dielectric properties
Purity99.9% – 99.99%Minimizes impurity-related defects
Diameter25 – 200 mm (custom available)Compatible with standard sputtering cathodes
Thickness3 – 6 mmInfluences target lifetime
Density≥ 95% theoreticalImproves plasma stability
Sputtering ModeRF sputteringRequired for ceramic oxides
BondingUnbonded / Cu or Ti backing (optional)Enhances thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
LaGaO₃High oxide-ion conductivity, thermal stabilitySOFC & oxide electronics
Yttria-Stabilized Zirconia (YSZ)Mature electrolyte materialSOFC electrolytes
Lanthanum Aluminate (LaAlO₃)Good lattice matchingOxide heterostructures
Strontium-Doped LaGaO₃ (LSGM)Enhanced ionic conductivityAdvanced SOFCs

FAQ

QuestionAnswer
Can the target composition be customized?Yes, doped LaGaO₃ compositions are available upon request.
Is RF sputtering required for LaGaO₃?Yes, LaGaO₃ is a ceramic oxide and typically requires RF sputtering.
Are bonded targets available?Yes, bonding to copper or titanium backing plates can be provided.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or crates.

Packaging

Our Lanthanum Gallate Sputtering Targets are meticulously tagged and vacuum-sealed to ensure traceability and protection from moisture and contamination. Robust export-grade packaging is used to prevent damage during storage and transportation.

Conclusion

Lanthanum Gallate (LaGaO₃) Sputtering Target provides a reliable solution for depositing high-quality perovskite oxide thin films with excellent ionic and dielectric performance. With precise composition control, high density, and flexible customization options, it is well suited for advanced energy devices, oxide electronics, and research applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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