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ST0160 Lanthanum Manganate Sputtering Target, LaMnO3

Chemical Formula: LaMnO3
Catalog Number: ST0160
CAS Number: 12031-12-8
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Manganate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Manganate Sputter Target Description

The Lanthanum Manganate Sputtering Target from TFM is an oxide sputtering material composed of lanthanum (La), manganese (Mn), and oxygen (O).

LanthanumLanthanum is a soft, malleable, silvery-white metal and is one of the most reactive rare earth elements. It is used in a variety of applications, including the production of special optical glasses and improving the malleability of steel. Lanthanum also plays a significant role in wastewater treatment and oil refining processes. Additionally, scientists have nicknamed lanthanum “super calcium” due to its use in photoconversion films, which enhance the efficiency of solar cells by converting ultraviolet light into visible light.

Related Product: Lanthanum Sputteering Target

manganeseManganese is a chemical element whose name may derive from the Latin word ‘magnes,’ meaning magnet, or from the black magnesium oxide known as ‘magnesia nigra.’ It was first mentioned in 1770 and observed by O. Bergman, with its isolation later accomplished and announced by G. Gahn. The chemical symbol for manganese is “Mn,” and its atomic number is 25. Manganese is located in Period 4, Group 7 of the periodic table, within the d-block. Its relative atomic mass is 54.938045(5) Dalton, with the number in brackets indicating the measurement uncertainty. Manganese is widely used in steel production to improve hardness, stiffness, and strength, and it also plays a role in various biological processes.

Related Product: Manganese Sputtering Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is essential for respiration in most life forms and plays a crucial role in combustion, oxidation, and various chemical processes.

Lanthanum Manganate Sputter Target Handling Notes

  • Indium Bonding: Indium bonding is recommended for the lanthanum manganate sputtering target due to its brittleness and low thermal conductivity, which make it less suitable for traditional sputtering methods.
  • Thermal Conductivity: This material has low thermal conductivity and is susceptible to thermal shock. Proper handling and bonding techniques are essential to prevent damage during the sputtering process.

Lanthanum Manganate Sputter Target Application

The Lanthanum Manganate Sputtering Target is utilized in a variety of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also important for functional coatings, the optical information storage industry, glass coatings for automotive and architectural purposes, and optical communication systems, among other fields.

Lanthanum Manganate Sputter Target Packing

Our Lanthanum Manganate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and strict quality control. We take great care to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

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TFM offers  Lanthanum Manganate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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