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VD0701 Lanthanum Niobium Oxide Evaporation Materials, LaNbO3

Catalog No.VD0701
MaterialLanthanum Niobium Oxide (LaNbO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a leading provider of high-purity lanthanum niobium oxide evaporation materials, among a broad selection of other evaporation materials. We supply these materials in both powder and granule forms, with the option for customized forms available upon request.

 

MSDS File

Lanthanum Niobium Oxide Evaporation Materials Overview

Lanthanum niobium oxide, known chemically as LaNbO3, is a high-purity evaporation material essential for advanced deposition processes. TFM (Thin-Film Mat Engineering) offers lanthanum niobium oxide with purity levels reaching up to 99.9995%, ensuring superior film quality for various applications.

Applications of Lanthanum Niobium Oxide

Our lanthanum niobium oxide materials are vital for several deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are particularly useful in optics for applications such as wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

To ensure the integrity of our lanthanum niobium oxide materials, we employ careful packaging procedures to prevent damage during storage and transportation. Each package is clearly labeled to facilitate easy identification and maintain strict quality control.

Contact Us

TFM is a leading provider of high-purity lanthanum niobium oxide materials, available in various forms such as tablets, granules, rods, and wires. We also offer customized shapes and quantities upon request. In addition, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or to inquire about other materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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