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Lanthanum Oxide Evaporation Materials

VD0702 Lanthanum Oxide Evaporation Materials, La2O3

Catalog No.VD0702
MaterialLanthanum Oxide (La2O3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) stands at the forefront of manufacturing and supplying high-purity lanthanum oxide evaporation materials. Our extensive range includes both powder and granule forms, with custom options available to meet specific needs. Whether you’re looking for standard or bespoke solutions, we ensure top-quality materials for all your evaporation processes.

MSDS File

Lanthanum Oxide Evaporation Materials Overview

Lanthanum Oxide Evaporation Materials from Thin-Film Mat Engineering (TFM) are high-purity compounds with the chemical formula La₂O₃. These materials are essential for achieving superior quality in deposition processes. With a purity level of up to 99.9995%, our lanthanum oxide evaporation materials are meticulously produced to ensure exceptional reliability and performance.

Related Products: Lanthanum Evaporation Materials

Lanthanum Oxide Evaporation Materials Specification

Material TypeLanthanum oxide
SymbolLa2O3
Color/AppearanceWhite Solid
Melting Point2,315 °C
Theoretical Density 6.51 g/cm3
Purity99.5% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

Lanthanum oxide evaporation materials are widely used in:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Utilized for wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our lanthanum oxide materials are carefully tagged and labeled to ensure easy identification and stringent quality control. We prioritize the protection of our products during storage and transport to prevent any damage.

Contact Us

At Thin-Film Mat Engineering (TFM), we are a premier supplier of high-purity lanthanum oxide evaporation materials. We offer various forms, including tablets, granules, rods, and wires, with custom options available upon request. In addition, we provide a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional inquiries, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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