Lanthanum Strontium Copper Oxide Sputtering Target

Description
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Material Type	Lanthanum Strontium Copper Oxide
Symbol	La_(1-x)Sr_xCuO₄
Color/Appearance	Various colors, Solid
Melting Point (°C)	N/A

Relative Density (g/cc)	>90%
Z Ratio	N/A
Sputter	RF, RF-R, DC
Max Power Density* (Watts/Square Inch)	N/A
Type of Bond	Indium, Elastomer

Lanthanum Strontium Copper Oxide Sputtering Targets

Applications

Lanthanum Strontium Copper Oxide (LSCO) sputtering targets are primarily used in the fabrication of thin films for various advanced electronic applications. These include:

Ferroelectric Materials
Gate Dielectrics
For CMOS Devices

Features

High Purity: Ensures consistent film quality and superior performance in critical applications.
Custom Sizes Available: Tailored to meet the precise needs of your project.

Manufacturing Process

Cold Pressing & Sintering: Targets are manufactured using cold pressing and sintering techniques to achieve optimal density and material integrity.
Elastomer Bonding: Elastomer bonding to the backing plate ensures stability during sputtering processes.
Cleaning & Final Packaging: Targets are thoroughly cleaned for vacuum use and packaged with protection from environmental contaminants to ensure quality during shipment.

Options Available

Purity: 99.9% minimum purity for high-performance results.
Smaller Sizes for R&D: Custom sizes available for research and development applications.
Sputtering Target Bonding Service: Available for enhanced target stability and performance.

For more information or to inquire about specific requirements, please contact us.

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FAQ

What is a sputtering target?

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

What materials are used to make sputtering targets?

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

How are sputtering targets manufactured?

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

How does sputter deposition work with these targets?

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

What factors affect the life and performance of a sputtering target?

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

How do I know when a sputtering target needs to be replaced?

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

Why do some sputtering targets need to be bonded to backing plates?

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

What is the difference between DC and RF sputtering for targets?

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

How does reactive sputtering differ from standard sputtering?

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

Can I use customer-supplied powders to make sputtering targets?

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

What storage and handling procedures are recommended for sputtering targets?

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

What key parameters affect sputtering deposition rates?

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).