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ST0896 Lanthanum Strontium Manganate Sputtering Target, La0.7Sr0.3MnO3

Chemical FormulaLa0.7Sr0.3MnO3
Catalog No.ST0896
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Strontium Manganate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Strontium Manganate Sputtering Target Description

The Lanthanum Strontium Manganate Sputtering Target is made from a combination of lanthanum, strontium, and manganese atoms. It is commonly used for producing thin films in a range of applications, including magnetic storage devices, electronic devices, and thin-film solar cells.

The Lanthanum Strontium Manganate (La₀.₇Sr₀.₃MnO₃) Sputtering Target is used in sputtering, a vapor deposition technique for applying thin films onto substrate surfaces. During sputtering, high-energy ions bombard the target material, causing atoms to be ejected. These ejected atoms then condense onto the substrate to form a thin film.

Lanthanum Strontium Manganate Sputtering Target Specifications

Compound FormulaLa0.7Sr0.3MnO3
AppearanceDark gray target
Density6.5 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Lanthanum Strontium Manganate Sputtering Target Handling Notes

Indium bonding is recommended for the Lanthanum Strontium Manganate Sputtering Target because its properties, such as brittleness and low thermal conductivity, can make sputtering challenging. The target’s low thermal conductivity also makes it prone to thermal shock, so indium bonding helps improve its performance and stability during the sputtering process.

Lanthanum Strontium Manganate Sputtering Target Application

The Lanthanum Strontium Manganate Sputtering Target is widely used in the production of thin films for various applications, including magnetic storage devices, electronic devices, and thin-film solar cells.

Lanthanum Strontium Manganate Sputtering Target Packaging

We ensure that our Lanthanum Strontium Manganate Sputtering Targets are meticulously handled during storage and transportation to maintain their quality and keep them in their original condition.

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TFM offers Lanthanum Strontium Manganate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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