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ST0164 Lanthanum Titanate Sputtering Target, LaTiO3

Chemical Formula: LaTiO3
Catalog Number: ST0164
CAS Number: 12031-47-9
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lanthanum Titanate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lanthanum Titanate Sputtering Target Description

The Lanthanum Titanate Sputtering Target from TFM is an oxide sputtering material composed of lanthanum (La), titanium (Ti), and oxygen (O).

LanthanumLanthanum is a soft, malleable, silvery-white metal and one of the most reactive rare earth elements. It is used in the production of special optical glasses and to improve the malleability of steel. Additionally, lanthanum is valuable in wastewater treatment and oil refining processes. Scientists have nicknamed lanthanum “super calcium” due to its use in photoconversion films, which enhance the efficiency of solar cells by converting ultraviolet light into visible light.

Related Product: Lanthanum Sputtering Target

TitaniumTitanium is a chemical element named after the Titans, the sons of the Earth goddess in Greek mythology. It was first mentioned in 1791 and observed by W. Gregor, with its isolation later accomplished and announced by J. Berzelius. The chemical symbol for titanium is “Ti,” and its atomic number is 22. Titanium is located in Period 4, Group 4 of the periodic table, within the d-block. Its relative atomic mass is 47.867(1) Dalton, with the number in brackets indicating the measurement uncertainty. Titanium is known for its high strength-to-weight ratio, corrosion resistance, and biocompatibility, making it widely used in aerospace, medical implants, and various industrial applications.

Related Product: Titanium Sputtering Target

OxygenOxygen is a chemical element whose name comes from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is essential for respiration in most life forms and plays a critical role in combustion, oxidation, and various chemical processes.

Available Sizes of Lanthanum Titanate Sputtering Target

MaterialSize
Lanthanum Titanate, LaTiO32.00″ Dia. x 0.125″ Thick
Lanthanum Titanate, LaTiO32.00″ Dia. x 0.250″ Thick
Lanthanum Titanate, LaTiO33.00″ Dia. x 0.125″ Thick
Lanthanum Titanate, LaTiO33.00″ Dia. x 0.250″ Thick
Lanthanum Titanate, LaTiO34.00″ Dia. x 0.125″ Thick
Lanthanum Titanate, LaTiO34.00″ Dia. x 0.250″ Thick
Lanthanum Titanate, LaTiO35.00″ Dia. x 0.125″ Thick
Lanthanum Titanate, LaTiO35.00″ Dia. x 0.250″ Thick
Lanthanum Titanate, LaTiO36.00″ Dia. x 0.125″ Thick
Lanthanum Titanate, LaTiO36.00″ Dia. x 0.250″ Thick
Lanthanum Titanate, LaTiO37.00″ Dia. x 0.125″ Thick
Lanthanum Titanate, LaTiO37.00″ Dia. x 0.250″ Thick
Lanthanum Titanate, LaTiO38.00″ Dia. x 0.125″ Thick
Lanthanum Titanate, LaTiO38.00″ Dia. x 0.250″ Thick

Lanthanum Titanate Sputtering Target Target Bonding

Indium Bonding is available for Lanthanum Titanate Sputtering Targets. TFM offers machining of standard backing plates and collaborates with the Taiwan Bonding Company to provide high-quality bonding services. This ensures optimal performance and longevity of the sputtering targets during use.

Lanthanum Titanate Sputtering Target Packaging

Our Lanthanum Titanate Sputter Targets are meticulously handled to prevent any damage during storage and transportation, ensuring that the products maintain their original high quality. We prioritize careful packaging and handling procedures to preserve the integrity and performance of our sputtering targets.

Get Contact

TFM offers Lanthanum Titanate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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