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VD0558B Lead Antimony Pellet Evaporation Material (PbSb)

MSDS File
Material TypeLead Antimony
SymbolPbSb
Melting Point (°C)N/A
DensityN/A
Exact MassN/A
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

Lead Antimony Pellet Evaporation Material

TFM supplies high-purity Lead Antimony Pellet Evaporation Material, engineered for thin-film deposition in infrared detection, optoelectronics, and advanced semiconductor applications. Composed of lead (Pb) and antimony (Sb), this material features excellent electrical conductivity, strong infrared absorption, and high thermal stability, making it ideal for infrared sensors, photodetectors, and optical coatings.

Designed for thermal evaporation and electron beam (E-beam) evaporation, Lead Antimony Pellet Evaporation Material ensures precise film uniformity, superior adhesion, and exceptional purity, enabling reliable performance in high-tech thin-film applications.

Key Features and Advantages

  • Superior Infrared Absorption: Perfect for long-wavelength infrared (LWIR) and mid-wavelength infrared (MWIR) detectors.

  • Optimized Electronic Properties: Supports infrared optoelectronics, photonic devices, and semiconductor applications.

  • High Purity & Stoichiometric Control: Guarantees consistent thin-film growth for enhanced device efficiency and durability.

  • Strong Film Adhesion & Uniform Deposition: Ensures reliable and defect-free coatings in optical and electronic applications.

  • Custom Compositions Available: Tailored to meet specific industry and research needs.

Applications

  • Infrared Imaging & Thermal Detection: Used in IR cameras, night vision systems, and thermal sensors for defense, aerospace, and industrial applications.

  • Optoelectronic & Photonic Devices: Plays a crucial role in photoelectric conversion, infrared communication, and high-precision imaging.

  • Semiconductor & Quantum Research: Supports quantum dot technology, topological insulators, and advanced nanoelectronics.

  • Thin-Film Coatings for Optical & Electronic Systems: Essential for precision optical coatings and high-sensitivity detection devices.

Industry Impact and Customization

TFM’s Lead Antimony Pellet Evaporation Material is designed to advance infrared detection, optoelectronics, and semiconductor technology. With customizable compositions, precise stoichiometry control, and superior evaporation characteristics, we ensure high-performance thin-film deposition for next-generation infrared and photonic applications.

With its outstanding electronic, optical, and infrared-responsive properties, TFM’s Lead Antimony Pellet Evaporation Material is an essential material for cutting-edge semiconductor innovations, infrared imaging, and high-tech photonic applications, providing enhanced efficiency, stability, and long-term reliability.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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