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Lead Platinum Sputtering Target

ST0502 Lead Platinum Sputtering Target, Pb/Pt

Chemical Formula: Pb/Pt
Catalog Number: ST0502
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lead Platinum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lead Platinum Sputtering Target Description

leadLead, also known as plumbum, is a chemical element that derives its name from the Anglo-Saxon word “lead” and the Latin word “plumbum.” It has been in use since around 7000 BC, first discovered by people from the Near East. The canonical chemical symbol for lead is “Pb,” and it holds the atomic number 82 on the periodic table, located in Period 6 and Group 14 within the p-block. The relative atomic mass of lead is 207.2(1) Dalton, with the number in parentheses indicating the uncertainty.

PlatinumPlatinum is a dense, malleable, ductile, and highly unreactive precious metal with a silverish-white appearance. The name “platinum” comes from the Spanish term “platino,” which means “little silver.” Among the six platinum-group metals (Pt, Pd, Os, Ir, Rh, and Ru), platinum is the most significant. It is resistant to oxygen and water, dissolving only in aqua regia or fused alkalis. Its most notable commercial use is in catalytic converters for vehicles.

Related Products: Lead Sputtering Target, Platinum Sputtering Target.

Lead Platinum Sputtering Target Specifications

Material TypeLead Platinum
SymbolPb/Pt
Color/AppearanceSolid
Melting Point117 °C
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Lead Platinum Sputtering Target Application

Lead Platinum Sputtering Targets are employed in various applications such as thin film deposition, decoration, semiconductor devices, displays, LEDs, and photovoltaic devices. They are also utilized in functional coatings, optical information storage, the glass coating industry (including car and architectural glass), and optical communication sectors.

Packing

Our Lead Platinum Sputtering Targets are meticulously tagged and labeled externally to facilitate easy identification and maintain quality control. We take extensive precautions to prevent any damage during storage and transportation.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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