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leadii-sulfide

VD0820 Lead(II) Sulfide Evaporation Materials, PbS

Catalog No.VD0820
MaterialLead Sulfide (PbS)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Lead(II) sulfide, or PbS, is a sulfide ceramic evaporation material offered by TFM. This material is known for its distinctive properties, making it suitable for various applications in evaporation processes.

MSDS File
Lead(II) Sulfide Evaporation Materials Overview

Lead(II) sulfide (PbS) evaporation materials, offered by TFM, are critical components in deposition processes for high-quality thin films. With a chemical formula of PbS, these materials are known for their high purity and reliability in various applications. TFM ensures that our PbS evaporation materials achieve purities up to 99.9995%, leveraging stringent quality control measures to maintain exceptional standards.

Lead(II) Sulfide Evaporation Materials Specification

Material TypeLead(II) Sulfide
SymbolPbS
Appearance/ColorBlack solid
Melting Point1,118 °C (2,044 °F; 1,391 K)
Density7.60 g/cm3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Lead(II) sulfide evaporation materials are employed in various deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are especially useful for optics applications, such as:

  • Wear Protection
  • Decorative Coatings
  • Displays

Packaging and Handling

Our lead(II) sulfide materials are meticulously packaged with clear labels to facilitate easy identification and quality control. We prioritize the protection of our products during storage and transportation to prevent any potential damage.

Contact Us

TFM stands out as a premier provider of high-purity lead(II) sulfide evaporation materials, available in various forms such as tablets, granules, rods, and wires. We also offer custom shapes and quantities to meet specific needs. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further details on our products, please reach out to us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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