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ST0167 Lead Titanate Sputtering Target, PbTiO3

Chemical Formula: PbTiO3
Catalog Number: ST0167
CAS Number: 12060-00-3
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lead Titanate  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lead Titanate Sputtering Target Description

The Lead Titanate Sputtering Target from TFM is an oxide sputtering material composed of lead (Pb), titanium (Ti), and oxygen (O).

leadLead, also known as plumbum, is a chemical element with the symbol “Pb,” derived from the Latin word “plumbum.” It has been used since around 7000 BC, discovered by ancient civilizations in the Near East. Lead has an atomic number of 82 and is located in Period 6, Group 14 of the periodic table, within the p-block. The relative atomic mass of lead is 207.2(1) Dalton, with the number in brackets indicating the measurement uncertainty. Lead is known for its high density, malleability, and resistance to corrosion, making it useful in a variety of applications including batteries, radiation shielding, and pigments.

Related Product: Lead Sputtering Target

TitaniumTitanium is a chemical element named after the Titans, the sons of the Earth goddess in Greek mythology. It was first mentioned and observed by W. Gregor in 1791, with its isolation later accomplished and announced by J. Berzelius. The chemical symbol for titanium is “Ti,” and its atomic number is 22. Titanium is located in Period 4, Group 4 of the periodic table, within the d-block. Its relative atomic mass is 47.867(1) Dalton, with the number in brackets indicating the measurement uncertainty. Titanium is known for its high strength-to-weight ratio, corrosion resistance, and biocompatibility, making it widely used in aerospace, medical implants, and various industrial applications.

Related Product: Titanium Sputtering Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is essential for life on Earth, playing a critical role in respiration, combustion, and various chemical processes.

Lead Titanate Sputter Target Handling Notes

  • Indium Bonding: Indium bonding is recommended for the lead titanate sputtering target due to its brittleness and low thermal conductivity, which make it less suitable for traditional sputtering methods.
  • Thermal Conductivity: This material has low thermal conductivity and is susceptible to thermal shock. Proper handling and bonding techniques are essential to prevent damage during the sputtering process.

Lead Titanate Sputter Target Application

The Lead Titanate Sputtering Target is utilized in a wide range of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also used in functional coatings, the optical information storage industry, glass coatings for automotive and architectural glass, and optical communication systems, among other fields.

Lead Titanate Sputter Target Packing

Our Lead Titanate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring that the products maintain their integrity and high quality upon delivery.

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TFM offers Lead Titanate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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