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Li₀.₃₈La₀.₅₆TiO₃ Sputtering Target, LLTO

Li₀.₃₈La₀.₅₆TiO₃ Sputtering Target – All You Need to KnowLi₀.₃₈La₀.₅₆TiO₃ Sputtering Target

Introduction

Li₀.₃₈La₀.₅₆TiO₃ (Lithium Lanthanum Titanate, often abbreviated as LLTO) Sputtering Target is a perovskite-type oxide material known for its high lithium-ion conductivity, chemical stability, and compatibility with advanced thin film applications. This compound plays a key role in the research and production of solid-state batteries, thin film electrolytes, and energy storage devices, where ionic transport efficiency and structural integrity are crucial.

Detailed Description

Li₀.₃₈La₀.₅₆TiO₃ is typically synthesized through solid-state reaction or sol–gel processing, resulting in a dense, homogeneous ceramic target. The material’s structure—based on a perovskite framework (ABO₃)—provides high Li⁺ ion mobility due to vacancies in the lattice, making it one of the most promising solid electrolytes for next-generation energy systems.

When fabricated as a sputtering target, the LLTO material can be bonded to a copper backing plate to enhance heat dissipation and ensure mechanical stability during magnetron sputtering. Typical targets are sintered to high density (>95%) to achieve uniform sputtering rates and consistent thin film composition.

Applications

Li₀.₃₈La₀.₅₆TiO₃ Sputtering Targets are widely used in the following fields:

  • Solid-State Batteries: as thin-film solid electrolytes with high ionic conductivity.

  • Microelectronic Devices: for interface layers and dielectric films.

  • Energy Storage Systems: for advanced lithium-ion and lithium-metal cell development.

  • Optoelectronic Thin Films: as part of multi-layer oxide stacks requiring ionic mobility control.

  • Research & Development: for exploring lithium-ion conducting oxide materials and solid-state interfaces.

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionLi₀.₃₈La₀.₅₆TiO₃High Li-ion conductivity
Purity99.9% (3N)Ensures stable sputtering and film quality
Density≥ 95% theoreticalPromotes uniform sputtering
Diameter25 – 100 mm (customizable)Compatible with standard sputtering systems
Thickness3 – 6 mmControls sputtering duration and stability
BondingCopper backing plate (In-bonded or elastomer)Enhances thermal conductivity
Crystal StructurePerovskiteEnables ionic mobility

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Li₀.₃₈La₀.₅₆TiO₃High ionic conductivity and thermal stabilitySolid-state electrolytes
Li₇La₃Zr₂O₁₂ (LLZO)Wider electrochemical windowLi-metal battery electrolyte
Li₃PO₄Excellent chemical stabilityThin-film lithium batteries
Al₂O₃High dielectric strengthProtective or insulating layers

FAQ

QuestionAnswer
Can the target be customized?Yes, dimensions, purity, and bonding type can be tailored to your sputtering system.
What backing plate options are available?Typically copper or titanium, bonded with indium or elastomer.
How is the target packaged?Vacuum-sealed with protective foam in export-safe cartons or wooden crates.
What sputtering methods are compatible?Suitable for RF and DC magnetron sputtering systems.
What industries use this target most?Battery research, microelectronics, and materials science.

Packaging

Each Li₀.₃₈La₀.₅₆TiO₃ Sputtering Target is securely labeled and vacuum-sealed to prevent contamination and moisture absorption. The packaging meets international export standards, ensuring safe delivery to research labs and production facilities worldwide.

Conclusion

Li₀.₃₈La₀.₅₆TiO₃ Sputtering Target provides a reliable and efficient material solution for thin-film solid electrolytes and advanced energy applications. With excellent ionic conductivity, high purity, and stable performance, it has become a key component in the development of all-solid-state lithium batteries.

For detailed specifications and quotations, please contact us at [sales@thinfilmmaterials.com].

Related Articles

Li₀.₃₈La₀.₅₆TiO₃ Sputtering Target – All You Need to Know

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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