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ST0876 Lithium Chloride Sputtering Target, LiCl

Chemical Formula: LiCl
Catalog Number: ST0876
CAS Number: 7447-41-8
Purity: 99.9% ~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Chloride (LiCl) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Chloride Sputtering Target Description

Lithium

Lithium Chloride (LiCl) Sputtering Target is a white sputtering material used primarily for producing lithium metal through electrolysis of a LiCl/KCl melt. It is also employed as a brazing flux for aluminum in automotive components.

Lithium is a chemical element derived from the Greek word ‘lithos,’ meaning stone. It was first identified in 1817 by A. Arfwedson and later isolated by W. T. Brande. The chemical symbol for lithium is ‘Li,’ and it has an atomic number of 3, located in Period 2, Group 1 of the periodic table, belonging to the s-block. Its relative atomic mass is 6.941(2) Dalton, with the number in brackets indicating the uncertainty.

Related: Lithium Sputtering Target

Lithium Chloride Sputtering Target Specification

Material TypeLithium Chloride
SymbolLiCl
Color/AppearanceWhite Solid
Molecular Weight42.39
Density2.07 g/cm3
Melting Point605 °C
Boiling Point1,382 °C
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Chloride Sputtering Target Packing

Our Lithium Chloride (LiCl) sputtering targets are clearly tagged and labeled externally for efficient identification and quality control. We take great care to prevent any damage during storage or transportation.

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TFM offers Lithium Chloride (LiCl) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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