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ST0171 Lithium Cobalt Oxide Sputtering Target, LiCoO2

Chemical Formula: LiCoO2
Catalog Number: ST0171
CAS Number: 12190-79-3
Purity: >99.7%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Cobalt Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Cobalt Oxide Sputtering Target Description

The Lithium Cobalt Oxide Sputtering Target from TFM is an oxide sputtering material composed of lithium (Li), cobalt (Co), and oxygen (O).

LithiumLithium is a chemical element named after the Greek word ‘lithos,’ meaning stone. It was first mentioned and observed by A. Arfwedson in 1817, with its isolation later accomplished and announced by W. T. Brande. The chemical symbol for lithium is “Li,” and its atomic number is 3. Lithium is located in Period 2, Group 1 of the periodic table, within the s-block. Its relative atomic mass is 6.941(2) Dalton, with the number in brackets indicating the measurement uncertainty. Lithium is known for its high reactivity and is commonly used in rechargeable batteries, lubricating greases, and as a flux additive in the production of glass and ceramics.

Related Product: Lithium Sputtering Target

Cobalt

Cobalt is a chemical element with the symbol “Co,” derived from the German word ‘kobald,’ meaning goblin. It was first mentioned in 1732 and observed by G. Brandt. Cobalt has an atomic number of 27 and is situated in Period 4, Group 9 of the periodic table, within the d-block. Its relative atomic mass is 58.933195(5) Dalton, with the number in brackets indicating the measurement uncertainty. Cobalt is known for its magnetic properties, high strength, and resistance to wear and corrosion. It is commonly used in the production of superalloys, batteries, pigments, and as a catalyst in various chemical reactions.

Related Product: Cobalt Sputtering Target

OxygenOxygen is a chemical element named after the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is essential for life on Earth, playing a critical role in respiration, combustion, and numerous chemical processes.

Lithium Cobalt Oxide Sputtering Target Target Bonding

Indium Bonding is available for Lithium Cobalt Oxide Sputtering Targets. TFM offers machining of standard backing plates and collaborates with the Taiwan Bonding Company to provide high-quality bonding services. This ensures optimal performance and durability of the sputtering targets during use.

Lithium Cobalt Oxide Sputtering Target Packaging

Our Lithium Cobalt Oxide Sputter Targets are meticulously handled to prevent any damage during storage and transportation, ensuring that the products maintain their original high quality. We implement strict handling and packaging protocols to preserve the integrity and performance of our sputtering targets.

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TFM offers Lithium Cobalt Oxide  Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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