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VD0559 Lithium Evaporation Materials, Li

Material Type: Lithium
Symbol: Li
Purity: 99.9%
Shape: Powder/ Granule/ Custom-made

TFM is a leading producer and supplier of high-purity lithium evaporation materials, alongside a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, with customization options available to meet specific needs.

MSDS File

Lithium Evaporation Material Description

Lithium is a silvery-white, very soft metal with a density of 0.53 g/cc, a melting point of 181°C, and a vapor pressure of 10⁻⁴ Torr at 407°C. It is highly flammable and reacts quickly with air. Although lithium and its compounds have various industrial uses, they are predominantly utilized in rechargeable batteries for smartphones, tablets, electric vehicles, and other devices.

High-purity lithium evaporation materials are essential for achieving high-quality results in deposition processes, leading to the creation of superior thin films. TFM specializes in manufacturing lithium evaporation materials with purity levels up to 99.99%, supported by stringent quality assurance processes to ensure their reliability and performance.

lithium evaporation materials

Lithium Evaporation Material Specification

Material TypeLithium
SymbolLi
Color/AppearanceSilvery White
Melting Point180.54°C
Boiling Point1342°C
Density0.534 g/cm3
Thermal Conductivity0.848 W/cm/K @ 298-C.2 K
SynonymsLi Pellets, Li Pieces, Li Evaporation Pellet, Lithium Pellets, Lithium Pieces, Lithium Evaporation Pellet

Lithium Evaporation Material Application

Lithium evaporation materials are utilized in various deposition processes, including semiconductor fabrication, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). These techniques are crucial for producing high-quality thin films for advanced technologies. In optics, lithium materials are used for wear protection, decorative coatings, and enhancing display technologies.

Lithium Evaporation Material Packaging

We carefully manage our lithium evaporation materials to prevent any damage during storage and transportation, ensuring that their quality and original condition are maintained.

Ordering Table

Material Size Quantity Purity Part Number
Lithium Approx 1/4" x 1/4" Pieces 25 g 99.9% EVMLI30QXQ-A
Lithium Approx 1/8" x 1/8" Pieces 25 g 99.9% EVMLI30EXE-A
Lithium Approx 1/8" x 1/8" Pieces 100 g 99.9% EVMLI30EXE-D

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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