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Lithium Fluoride Evaporation Materials

VD0783 Lithium Fluoride Evaporation Materials, LiF

Catalog No.VD0783
MaterialLithium Fluoride
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity lithium fluoride (LiF) evaporation materials. We offer a diverse selection of evaporation materials, available in both powder and granule forms. For specialized needs, we also provide customized options upon request to meet your specific requirements.

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Lithium Fluoride Evaporation Materials Overview

Lithium fluoride (LiF) is a fluoride ceramic material with the chemical formula LiF, known for its crystalline, white appearance. It has a density of 2.64 g/cm³, a melting point of 845 °C, and a vapor pressure of 10⁻⁴ Torr at 1,180 °C. Lithium fluoride is commonly used as a component in molten salts and is vital in deposition processes to achieve high-quality film layers. TFM specializes in producing lithium fluoride evaporation materials with a purity of up to 99.9995%, ensuring exceptional performance and reliability.

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Lithium Fluoride Evaporation Materials Specification

Material TypeLithium Fluoride
SymbolLiF
Appearance/ColorWhite crystalline powder
Melting Point845 °C (1,553 °F; 1,118 K)
Density2.635 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Lithium fluoride evaporation materials are utilized in various deposition processes, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

They are primarily employed in optics for applications such as wear protection, decorative coatings, and display technologies.

Packaging

Our lithium fluoride evaporation materials are meticulously tagged and labeled for efficient identification and quality control. We take great care to ensure that the materials are protected from damage during storage and transport.

Contact Us

TFM offers lithium fluoride evaporation materials in several forms, including tablets, granules, rods, and wires. We also provide customized shapes and quantities upon request. In addition, we supply various evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further information on our products, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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