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ST0244 Lithium Fluoride Sputtering Target, LiF

Chemical Formula: LiF
Catalog Number: ST0244
CAS Number: 7789-24-4
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Fluoride Sputtering Target Description

Lithium Fluoride Sputtering Target is crafted from a ceramic fluoride material that combines lithium and fluorine elements. This target is specifically used in thin-film deposition processes within various industrial applications.

Lithium

Lithium, represented by the symbol “Li,” is a chemical element that derives its name from the Greek word ‘lithos,’ meaning stone. It was first identified by A. Arfwedson in 1817, and W. T. Brande later achieved its isolation. Positioned in the periodic table as element number 3, lithium resides in Period 2 and Group 1, classified under the s-block. The atomic mass of lithium is approximately 6.941(2) Dalton, with the number in parentheses indicating the uncertainty of this measurement.

Related Product: Lithium Sputtering Target

Fluorine

Fluorine, often referred to as fluorin, is a chemical element that traces its name to the Latin word ‘fluere,’ meaning to flow. First mentioned in 1810 by A.-M. Ampère, its isolation was successfully achieved and subsequently announced by H. Moissan. Represented by the chemical symbol “F,” fluorine holds the atomic number 9 and is positioned in Period 2, Group 17 of the periodic table, falling under the p-block category. The atomic mass of fluorine is recorded as 18.9984032(5) Dalton, with the numbers in parentheses reflecting the uncertainty of this value.

Lithium Fluoride Sputtering Target Application

The Lithium Fluoride Sputtering Target finds extensive applications across various industries, particularly in thin film deposition. It is utilized in the manufacturing and enhancement of products such as semiconductors, displays, LEDs, and photovoltaic devices. Additionally, it plays a crucial role in the decorative and functional coating processes, including those used in optical data storage, the automotive glass industry, architectural glass sectors, and optical communications.

Lithium Fluoride Sputtering Target Packing

Our Lithium Fluoride Sputter Targets are clearly marked and labeled on the outside to facilitate easy identification and ensure stringent quality control. We take meticulous precautions to prevent any potential damage during storage or transport.

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TFM offers Lithium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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