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ST0244 Lithium Fluoride Sputtering Target, LiF

Chemical Formula: LiF
Catalog Number: ST0244
CAS Number: 7789-24-4
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Lithium Fluoride (LiF) sputtering targets are widely used in optical coatings, vacuum deposition, and advanced electronics due to their exceptional transparency in the ultraviolet (UV) and vacuum ultraviolet (VUV) regions. As a highly stable ionic compound with low refractive index and excellent radiation resistance, LiF is a key material for precision optical systems and thin film technologies. High-quality sputtering targets are essential to ensure uniform film deposition and reliable optical performance.

Detailed Description

Lithium Fluoride is a crystalline alkali halide compound with a wide bandgap (~14 eV), making it one of the most transparent materials across deep UV to infrared wavelengths. This property makes LiF particularly valuable for optical coatings where minimal absorption and high transmission are required.

LiF sputtering targets are typically manufactured using high-purity raw materials through controlled pressing and sintering processes. Due to its brittle nature and sensitivity to moisture, careful handling and processing are required to maintain structural integrity and surface quality. Even trace contamination or hydration can affect optical performance, especially in UV-sensitive applications.

The density and microstructure of the target significantly influence sputtering behavior. High-density LiF targets reduce particle generation and provide stable deposition rates. Because LiF is an insulating material, RF magnetron sputtering is generally preferred to maintain plasma stability. Optional bonding to copper backing plates improves thermal conductivity and helps prevent cracking under thermal stress during deposition.

Applications

Lithium Fluoride Sputtering Targets are widely used in:

  • Optical Coatings: Anti-reflective and high-transmission coatings in UV/VUV optics
  • Space and Radiation Optics: Components exposed to high-energy radiation environments
  • Semiconductor and Display Technologies: Functional thin films in advanced devices
  • Surface Protection Layers: Low refractive index coatings for optical stacks
  • Scientific Research: Thin film studies in photonics and materials science

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaLiFDefines compound composition
Purity≥ 99.9% (3N)Ensures optical clarity and film consistency
Density≥ 95% theoretical densityImproves sputtering stability
Diameter25 – 150 mm (custom)Compatible with sputtering systems
Thickness3 – 6 mmInfluences deposition rate
BondingUnbonded / Cu-backedEnhances heat dissipation
Sputtering MethodRF MagnetronSuitable for insulating materials

Comparison with Related Materials

MaterialKey AdvantageTypical Application
LiFExcellent UV/VUV transparency, low indexOptical coatings, space optics
MgF₂Durable, widely used optical coatingAnti-reflective coatings
CaF₂Broad spectral transmissionInfrared optics
NaFSimilar structure, lower stabilitySpecialized optical uses

FAQ

QuestionAnswer
Why is LiF preferred for UV optics?Due to its extremely high transparency in the deep UV and VUV regions.
Is LiF suitable for DC sputtering?No, LiF is an insulator and typically requires RF sputtering.
Can the target be customized?Yes, size, purity, and bonding options can be tailored.
How should LiF targets be stored?In a dry, moisture-controlled environment to prevent degradation.
What industries use LiF sputtering targets?Optics, aerospace, semiconductor, and research institutions.

Packaging

Our Lithium Fluoride Sputtering Target, LiF, is meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the target arrives in optimal condition.

Conclusion

Lithium Fluoride Sputtering Targets provide an ideal solution for producing high-performance optical thin films, especially in UV and VUV applications. With high purity, excellent transparency, and customizable configurations, LiF targets are well-suited for both industrial and research environments.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

LiF target 99.9% Ø3"×3 mm, Bonded to 3 mm Cu BP, LiF:AlF₃ target 99.9% Ø3"×3 mm, Bonded to 3 mm Cu BP

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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