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ST0529 Lithium Iron Phosphate Sputtering Target, LiFePO4

Chemical Formula: LiFePO4
Catalog Number: ST0529
CAS Number: 15365-14-7
Purity: 99.5%, 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Iron Phosphate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Iron Phosphate Sputtering Target Description

Lithium iron phosphate

Lithium Iron Phosphate Sputtering Target is a mixed oxide ceramic sputtering target, typically produced through high-temperature sintering or recrystallization of an oxide mixture of lithium and iron. Lithium iron phosphate appears as a gray, red-grey, brown, or black solid that is insoluble in water. It possesses unique physical properties, making it ideal for specialized applications in the electronics, superconductivity, and optical industries.

Related Products: Lithium Sputtering Targets, Platinum Sputtering Targets.

Lithium Iron Phosphate Sputtering Target Specification

Material TypeLithium Iron Phosphate Sputtering Target
SymbolLiFePO4
Color/AppearanceMetallic, Solid
Melting Point >300 °C
SputterRF, RF-R, DC
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Iron Phosphate Sputtering Target Applications

Lithium Iron Phosphate (LiFePO4) sputtering targets are essential in several industries, particularly for the development of lithium-ion batteries and energy storage systems. These targets are vital for depositing thin films of LiFePO4 onto substrates, leveraging the material’s stability, high energy density, and safety. LiFePO4 is widely recognized as a preferred material in rechargeable battery technology.

Lithium Iron Phosphate Sputtering Target Bonding Services

Specialized bonding services for Lithium Iron Phosphate Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Lithium Iron Phosphate Sputtering Target Packing

Our Lithium Iron Phosphate sputter targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage that might be caused during storage or transportation.

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TFM offers Lithium Iron Phosphate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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