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Lithium Nickel Oxide Sputtering Target

ST0914 Lithium Nickel Oxide Sputtering Target, LiNiO2

Chemical FormulaLiNiO2
Catalog No.ST0914
CAS Number12031-65-1
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Lithium Nickel Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Nickel Oxide Sputtering Target Description

Lithium Nickel Oxide Sputtering Target is a specialized material used in the sputter deposition process, which is essential for thin-film manufacturing and coating applications.

Sputtering is a technique where high-energy ions bombard a target material, causing atoms or molecules to be ejected. These ejected particles then deposit onto a substrate to form a thin film. Lithium Nickel Oxide (LiNiO2) is a compound composed of lithium, nickel, and oxygen. It is particularly valuable in producing cathode materials for lithium-ion batteries.

The sputtering process with Lithium Nickel Oxide Targets allows for precise control over the thin film’s deposition, making it crucial for applications in electronics, energy storage, and optics. This process ensures the creation of thin films with tailored properties and compositions for various industrial uses.

Related Product: Lithium Nickel Cobalt Oxide Sputtering Target

Lithium Nickel Oxide Sputtering Target Specifications

Compound FormulaLiNiO2
Molecular Weight97.63
AppearanceGray Target
Melting Point>1000℃
Density–
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Lithium Nickel Oxide Sputtering Target Handling Notes

Indium bonding is recommended for Lithium Nickel Oxide Sputtering Targets due to the material’s inherent characteristics that are less suited for traditional sputtering techniques. Lithium Nickel Oxide (LiNiO2) is known for its brittleness and low thermal conductivity, which can make it prone to thermal shock during the sputtering process. Indium bonding helps mitigate these issues by providing a more stable and reliable method for maintaining the integrity of the target during use.

Lithium Nickel Oxide Sputtering Target Application

Lithium Nickel Oxide Sputtering Target is widely utilized across various industries, including:

  • Electronics: For manufacturing electronic components and devices.
  • Energy Storage: In the production of cathode materials for lithium-ion batteries.
  • Optics: For applications requiring specialized thin film coatings.

Lithium Nickel Oxide Sputtering Target Packaging

Our Lithium Nickel Oxide Sputtering Targets are meticulously handled during both storage and transportation to maintain their quality and ensure they arrive in their original condition.

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TFM offers Lithium Nickel Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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