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lithium-silicate

ST0453 Lithium Silicate Sputtering Target, Li4SiO4

Chemical Formula: Li4SiO4
CAS Number: 13453-84-4
Catalog Number: ST0453
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Silicate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Silicate Sputtering Target Description

Lithium

The Lithium Silicate Sputtering Target is a black sputtering material composed of lithium (Li), silicon (Si), and oxygen (O). It serves as a conductive ceramic solid electrolyte material, crucial for lithium-ion batteries.

Lithium is a chemical element derived from the Greek word “lithos,” meaning stone. It was first mentioned in 1817 by A. Arfwedson, with isolation accomplished and announced by W. T. Brande. The chemical symbol for lithium is “Li.” It has an atomic number of 3 and is located in Period 2, Group 1 of the periodic table, belonging to the s-block. The relative atomic mass of lithium is 6.941(2) Dalton, with the number in parentheses indicating the uncertainty.Related: Lithium Sputtering Target

SiliconSilicon is a chemical element that originated from the Latin word ‘silex’ or ‘silicis’, meaning flint. It was first mentioned in 1824 by J. Berzelius, who also accomplished its isolation. The canonical chemical symbol for silicon is “Si.” It has an atomic number of 14, is located in Period 3 and Group 14 of the periodic table, and belongs to the p-block. The relative atomic mass of silicon is 28.0855(3) Dalton, with the number in brackets indicating the uncertainty.

Lithium Silicate Sputtering Target Specification

Material TypeLithium Silicate
SymbolLi4SiO4
Color/AppearanceWhite Solid
Melting Point1,256 °C
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Silicate Sputtering Target Packaging

Our Lithium Silicate Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation, preserving the quality of our products in their original condition.

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TFM offers Lithium Silicate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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