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ST0530 Lithium Sulfide Sputtering Target, Li2S

Chemical Formula: Li2S
Catalog Number: ST0530
CAS Number: 12136-58-2
Purity: 99.9% ~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Lithium Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Sulfide Sputtering Target Description

LithiumLithium Sulfide sputtering target is a silvery material composed of lithium (Li) and sulfur (S). It is considered for use in lithium-sulfur batteries due to its potential to enhance battery performance.

Lithium is a chemical element derived from the Greek word ‘lithos,’ meaning stone. It was first identified in 1817 by A. Arfwedson, with its isolation later achieved and announced by W. T. Brande. Represented by the symbol “Li,” lithium has an atomic number of 3, placing it in Period 2 and Group 1 of the periodic table, within the s-block. Its relative atomic mass is 6.941(2) Dalton, with the number in brackets indicating the uncertainty.

Related: Lithium Sputtering Target

SulfurSulfur, also known as sulphur, is a chemical element whose name is derived from either the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium,’ both referring to sulfur. It has been used since before 2000 BC and was recognized by ancient Chinese and Indian civilizations. The canonical chemical symbol for sulfur is “S,” and its atomic number is 16, placing it in Period 3 and Group 16 of the periodic table, within the p-block. The relative atomic mass of sulfur is 32.065(5) Dalton, with the number in brackets indicating the uncertainty.

Lithium Sulfide Sputtering Target Specification

Material TypeLithium Sulfide
SymbolLi2S
Color/AppearanceSilvery Solid
Molecular Weight45.95
Melting Point938° C
Boiling Point1372° C
Density1.67 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Sulfide Sputtering Target Packing

Our Lithium Sulfide Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage that might occur during storage or transportation.

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TFM offers Lithium Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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