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lithium-zirconate

ST0455 Lithium Zirconate Sputtering Target

Chemical Formula: LiZrOx
CAS Number: 12031-83-3
Catalog Number: ST0455
Purity: 99.9%, 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

lithium zirconate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Lithium Zirconate Sputtering Target Description

Lithium

Lithium zirconate sputtering target is a black sputtering material composed of lithium and zirconium. This conductive ceramic solid electrolyte material is primarily used in lithium-ion batteries.

Lithium is a chemical element derived from the Greek word ‘lithos,’ meaning stone. It was first identified in 1817 by A. Arfwedson, with its isolation later achieved and announced by W. T. Brande. Represented by the symbol “Li,” lithium holds the atomic number 3 in the periodic table, located at Period 2 and Group 1, within the s-block elements. Its relative atomic mass is approximately 6.941 Daltons, with the number in parentheses indicating a margin of uncertainty.

Zirconium

Zirconium is a chemical element named after the Persian word ‘zargun,’ meaning gold-colored. It was first mentioned in 1789 and observed by H. Klaproth. The isolation was later achieved and announced by J. Berzelius. Represented by the symbol “Zr,” zirconium has an atomic number of 40 in the periodic table, located at Period 5 and Group 4, within the d-block elements. Its relative atomic mass is approximately 91.224 Daltons, with the number in parentheses indicating the uncertainty.

Lithium Zirconate Sputtering Target Specification

Material Type Lithium Zirconate
Symbol LiZrOx
Color/Appearance White Solid
Available Sizes Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Lithium Zirconate Sputtering Target Packaging

Our lithium zirconate sputtering targets are meticulously tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation, preserving the quality of our products in their original condition.

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TFM offers lithium zirconate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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