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ST0028A Magnesium Aluminate Sputtering Targets (MgAl2O4)

MSDS File
Material TypeMagnesium aluminate
SymbolMgAl2O4
Color/AppearanceWhite
Melting Point (°C)N/A
Density3.64 g/cm3
Molecular Weight142.27
Sputter
Exact Mass141.927777

Magnesium Aluminate Sputtering Targets

Overview

Magnesium aluminate (MgAl₂O₄), also known as spinel (MAS), is a synthetic material with a cubic crystal structure, offering outstanding chemical, thermal, dielectric, mechanical, and optical properties. These exceptional features make magnesium aluminate a crucial material in applications such as optically transparent windows, domes, armors, and certain refractory technologies.

Magnesium Aluminate Sputtering Targets Information

  • Purity: 99.99%
  • Circular: Diameter ≤ 14 inch, Thickness ≥ 1 mm
  • Block: Length ≤ 32 inch, Width ≤ 12 inch, Thickness ≥ 1 mm

More Information on Magnesium Aluminate Sputtering Targets

Applications

  • Ferroelectric
  • Gate Dielectric
  • For CMOS

Features

  • High Purity: Ensures high-quality sputtering with minimal contamination and superior thin film quality.
  • Custom Sizes Available: Customizable sizes to suit specific application requirements.

Manufacturing Process

  • Cold Pressed and Sintered: Magnesium aluminate is carefully processed using cold pressing and sintering methods for optimum density and consistency.
  • Elastomer Bonded to Backing Plate: Provides superior adhesion and stability during the sputtering process.
  • Cleaning and Final Packaging: Targets are cleaned for vacuum applications, ensuring protection from environmental contaminants during shipping.

Options

  • 99.99% Minimum Purity: Ideal for demanding applications requiring high-purity materials.
  • Smaller Sizes for R&D Applications: Available for research and development purposes.
  • Sputtering Target Bonding Service: Custom bonding options to improve target durability and performance.

For further details or to request a quote, please contact us directly.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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