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magnesium-diboride

VD0835 Magnesium Diboride Evaporation Materials, MgB2

Catalog No.VD0835
MaterialMagnesium Boride (MgB2)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top manufacturer and supplier of premium magnesium diboride evaporation materials. Our extensive range includes not only high-purity magnesium diboride but also a diverse selection of other evaporation materials. We offer these materials in both powder and granule forms to meet various needs. Additionally, we provide customized solutions tailored to specific requirements upon request.

MSDS File
Magnesium Diboride Evaporation Materials Overview

TFM provides top-quality magnesium diboride (MgB₂) evaporation materials, renowned for their exceptional purity and performance. Magnesium diboride, a boride ceramic with the chemical formula MgB₂, is essential for high-quality film deposition processes. Our high-purity MgB₂, reaching up to 99.9995%, is produced under stringent quality assurance protocols to ensure reliable and consistent results.

Product Specifications

Material TypeMagnesium diboride
SymbolMgB2
Appearance/ColorSolid
Melting Point830 °C (1,530 °F; 1,100 K) (decomposes)
Density2.57 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Magnesium diboride evaporation materials are utilized in a range of deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are primarily used for optics applications such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our magnesium diboride materials are carefully tagged and labeled to ensure precise identification and quality control. We prioritize the protection of our products during storage and transportation to prevent any damage.

Contact Us

TFM is a leading provider of high-purity magnesium diboride evaporation materials. We offer various forms including tablets, granules, rods, and wires, with custom shapes and quantities available upon request. In addition, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further information, please reach out to us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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