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ST0246 Magnesium Fluoride Sputtering Target, MgF2

Chemical Formula: MgF2
Catalog Number: ST0246
CAS Number: 7783-40-6
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Magnesium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Magnesium Fluoride Sputtering Target Description

Fluorine

Magnesium

Magnesium Fluoride Sputtering Targets, offered by TFM, consist of the inorganic compound MgF2. This material is a white crystalline salt, notable for its transparency across a broad spectrum of wavelengths. Its optical properties find commercial applications, particularly in the production of components for space telescopes. Magnesium fluoride naturally occurs as the rare mineral sellaite and is primarily used in thin film deposition processes.

Related Product: Magnesium Sputtering Target.

Magnesium Fluoride Sputtering Target Specification

Material TypeMagnesium Fluoride
SymbolMgF2
Color/AppearanceWhite, Crystalline Solid
Melting Point1,261℃
SputterRF
Type of BondIndium, Elastomer
CommentsSubstrate temp and rate control important. Reacts with W. Mo OK.
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Magnesium Fluoride Sputtering Target Bonding Service

Specialized bonding services for Magnesium fluoride Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packing

Our Magnesium Fluoride Sputter Targets are meticulously tagged and labeled on the exterior to facilitate efficient identification and ensure stringent quality control. We take exceptional care to safeguard against any potential damage during storage or transportation, ensuring the targets remain in pristine condition.

Get Contact

TFM offers Magnesium Fluoride Sputtering Targets in a variety of forms, purities, sizes, and price points. We specialize in creating high-purity thin film coating materials designed to achieve the highest density and the finest average grain sizes. These materials are ideal for use in semiconductor applications, as well as chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes for display and optical applications. For current pricing on sputtering targets and other deposition materials not listed, please send us an inquiry.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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