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ST0263 Magnesium Silicide Sputtering Target, Mg2Si

Chemical Formula: Mg2Si
Catalog Number: ST0263
CAS Number: 22831-39-6
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

magnesium silicide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Magnesium Silicide Sputtering Target Description

Magnesium Silicide Sputtering Target: A type of silicide ceramic sputtering target composed of magnesium and silicon.

Magnesium

Magnesium is a chemical element originating from Magnesia, a district of Eastern Thessaly in Greece. It was first mentioned in 1755 and observed by Joseph Black. The isolation was later accomplished and announced by Humphry Davy. The canonical chemical symbol for magnesium is “Mg.” Its atomic number in the periodic table is 12, and it is located in Period 3 and Group 2, belonging to the s-block. The relative atomic mass of magnesium is 24.3050(6) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Magnesium Sputtering Target

Silicon

Silicon is a chemical element derived from the Latin silex or silicis, meaning flint. It was first mentioned in 1824 and observed by Jöns Jacob Berzelius. The isolation was later accomplished and announced by Berzelius. The canonical chemical symbol for silicon is “Si.” Its atomic number in the periodic table is 14, and it is located in Period 3 and Group 14, belonging to the p-block. The relative atomic mass of silicon is 28.0855(3) Dalton, with the number in brackets indicating the uncertainty.

Magnesium Silicide Sputtering Target Application

Magnesium silicide sputtering targets are used in a variety of applications including thin film deposition, decoration, and the production of semiconductor devices. These targets are suitable for use in displays, LED technologies, and photovoltaic devices. They are also employed in functional coatings, optical information storage, glass coating industries such as car glass and architectural glass, and optical communication technologies.

Magnesium Silicide Sputtering Target Packing

Our magnesium silicide sputter targets are carefully tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation, ensuring that the targets arrive in optimal condition.

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TFM offers magnesium silicide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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