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VD0630 Manganese Copper Evaporation Materials, Mn/Cu

Catalog No.VD0630
MaterialManganese Copper (Mn/Cu)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) specializes in producing high-purity manganese copper evaporation materials, utilizing rigorous quality assurance processes to ensure reliable performance. We offer these materials in a variety of forms, including tablets, granules, pellets, and powder, to accommodate a wide range of application needs.

MSDS File

Manganese Copper Evaporation Materials Overview

Thin-Film Mat Engineering (TFM) offers high-purity manganese copper evaporation materials, an alloy comprising manganese (Mn) and copper (Cu). These materials are essential for producing high-quality films in various deposition processes. With purity levels up to 99.9995%, our manganese copper evaporation materials are manufactured with rigorous quality assurance to ensure reliable and consistent performance.

Applications of Manganese Copper Evaporation Materials

Manganese copper evaporation materials are utilized in several key applications, including:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

To maintain the highest quality, we handle and package our manganese copper evaporation materials with great care. This ensures that the products are protected from damage during storage and transportation, preserving their original condition.

Contact Us

At TFM, we are a leading manufacturer and supplier of high-purity manganese copper evaporation materials. Our offerings include various forms such as tablets, granules, rods, and wires, with customization available upon request. We also provide additional evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and information on other materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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