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Nickel Cobalt Sputtering Target

Manganese Gadolinium Sputtering Target

PropertyDetails
Chemical FormulaGd
Catalog No.ST0988
CAS Number7440-54-2
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made
DescriptionRenowned for their exceptional purity and outstanding performance, Gadolinium sputtering targets from TFM exemplify superior quality in advanced materials. Leveraging deep materials science expertise and precision manufacturing, our Gd targets deliver remarkable consistency, excellent magnetic and optical properties, and enhanced durability across various thin film applications. With competitive pricing and customizable shapes, TFM ensures these targets exceed customer expectations in every dimension.

Manganese Gadolinium Sputtering Target

Introduction

The Manganese Gadolinium Sputtering Target is a specialized alloy material engineered for advanced thin film deposition. By combining manganese’s magnetic and catalytic properties with gadolinium’s unique magnetic and optical behavior, this sputtering target is particularly valuable in research areas such as spintronics, magnetic recording media, optical coatings, and functional thin films. Its tailored composition makes it suitable for both industrial coating systems and academic R&D environments.

Detailed Description

Manganese Gadolinium sputtering targets are manufactured using high-purity raw materials consolidated by vacuum melting or powder metallurgy. This ensures dense, homogeneous targets with minimal impurity levels, resulting in stable sputtering rates and high-quality thin films.

  • Composition: Mn–Gd alloy ratios are available in standard or customized formulations depending on performance requirements.

  • Purity: Typical purities range from 99.9% to 99.99%, minimizing contamination in thin films.

  • Microstructure: Dense, fine-grain structures improve adhesion, film uniformity, and reproducibility.

  • Size & Shapes: Available in circular (25–300 mm diameter), rectangular, and custom geometries. Thicknesses typically range from 3–6 mm.

  • Bonding Options: Indium or elastomer bonding to copper/titanium backing plates can be provided for improved heat dissipation and durability.

Applications

Manganese Gadolinium sputtering targets find use in multiple high-tech fields:

  • Magnetic Thin Films – Spintronics, data storage, and magnetic sensors.

  • Optical Coatings – Infrared and visible light coatings for advanced optics.

  • Semiconductors & Electronics – Functional thin films for microelectronics and insulating layers.

  • Energy & Research – Thin films for next-generation energy devices and exploratory materials science.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures film uniformity and reduced contamination
Diameter25 – 300 mm (custom)Fits most sputtering system holders
Thickness3 – 6 mmInfluences sputtering efficiency and stability
BondingCopper / Titanium backingImproves heat transfer and target longevity
Composition (Mn:Gd)Custom ratios availableEnables tuning of magnetic and optical properties

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Manganese Gadolinium (Mn–Gd)Magnetic + optical synergySpintronics, advanced coatings
Pure Gadolinium TargetHigh magnetic moment, optical useMagneto-optical films
Pure Manganese TargetCatalytic & magnetic propertiesSemiconductor films, magnetic alloys

FAQ

QuestionAnswer
Can the Mn:Gd ratio be adjusted?Yes, the alloy composition can be customized based on your application needs.
What is the lead time?Standard lead time is around 2–3 weeks, depending on order size.
Is bonding to a backing plate required?For large-diameter or high-power applications, bonding with Cu/Ti backing plates is recommended.
How is the product packaged?Vacuum-sealed, cushioned with protective foam, and shipped in export-grade cartons or wooden crates.
Which industries use it most?Spintronics, semiconductors, optics, and advanced R&D laboratories.

Packaging

All Manganese Gadolinium Sputtering Targets are vacuum-sealed to protect against oxidation and contamination. They are externally labeled for traceability and securely packed with foam inserts inside durable cartons or wooden crates to ensure safe transport and storage.

Conclusion

Manganese Gadolinium Sputtering Targets provide a powerful combination of magnetic and optical properties, making them indispensable for advanced thin film deposition in research and industrial applications. With high purity, customizable alloy ratios, and strong performance stability, they are an excellent choice for next-generation coatings.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

Order Now

Manganese Gadolinium (Mn:Ga = 50%:50%), Diameter 50.8*Height 2.5mm (+/-0.1mm), Manganese Gadolinium (Mn:Ga = 50%:50%), Diameter 50.8*Height 5mm (+/-0.1mm)

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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