Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
nickel-cobalt-sputtering-target-removebg-preview-1

Manganese Gadolinium Sputtering Target

PropertyDetails
Chemical FormulaGd
Catalog No.ST0988
CAS Number7440-54-2
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made
DescriptionRenowned for their exceptional purity and outstanding performance, Gadolinium sputtering targets from TFM exemplify superior quality in advanced materials. Leveraging deep materials science expertise and precision manufacturing, our Gd targets deliver remarkable consistency, excellent magnetic and optical properties, and enhanced durability across various thin film applications. With competitive pricing and customizable shapes, TFM ensures these targets exceed customer expectations in every dimension.
MSDS File

Manganese Gadolinium Sputtering Target Description

Manganese Gadolinium Sputtering Target is characterized by its superior purity and specialized magnetic properties, ensuring reliable performance in thin film deposition. The combination of manganese and gadolinium delivers excellent magnetic behavior, chemical stability, and thermal resistance—making this target ideal for applications in advanced electronics and spintronic devices. Its consistent performance under high-vacuum and high-temperature conditions highlights its role in critical thin film applications requiring magnetic responsiveness and structural integrity.

Related Product: Manganese Sputtering Target, Gadolinium Sputtering Target

Manganese Gadolinium Sputtering Target Specifications

 

Chemical FormulaMn-Gd
Catalog No.ST0978
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made
AppearanceSilver Grey Metallic Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Manganese Gadolinium Sputtering Target Handling Notes

Due to the brittleness and relatively low thermal conductivity of Manganese Gadolinium alloy, indium bonding is highly recommended for optimal heat transfer and mechanical stability during sputtering. This method reduces thermal stress, enhances deposition uniformity, and improves the longevity of the target in demanding PVD processes. Proper storage and handling are essential to preserve the surface quality and performance.

Manganese Gadolinium Sputtering Target Application

Manganese Gadolinium Sputtering Target plays a critical role in the fabrication of magnetic thin films used in spintronics, magnetic sensors, and memory storage devices. Its strong magnetic interaction and thermal stability make it ideal for:

  • Magnetic storage and data recording components

  • Magneto-optical films

  • Spintronic and quantum computing applications

  • MEMS and magnetic sensor elements

  • Research in rare earth-manganese alloy thin films

The unique synergy of manganese and gadolinium also supports development in optical coatings and advanced semiconductor devices, where consistent magnetic behavior and structural reliability are required.

Manganese Gadolinium Sputtering Target Packaging

TFM ensures all Manganese Gadolinium Sputtering Target products are carefully packaged in vacuum-sealed, anti-static bags and cushioned with foam or shock-absorbent materials. Each unit is placed inside protective containers suitable for domestic and international shipment, guaranteeing quality and safety from our facility to your sputtering system.

Get Contact

TFM offers Manganese Gadolinium Sputtering Target in a wide range of purities, sizes, and configurations, with custom fabrication available to suit your deposition system. Our advanced processing ensures high-density targets with uniform grain structure, optimized for use in semiconductor, magnetic, research, and optical industries.

Feel free to contact us for quotes, lead times, or technical consultation.

Order Now

Manganese Gadolinium (Mn:Ga = 50%:50%), Diameter 50.8*Height 2.5mm (+/-0.1mm), Manganese Gadolinium (Mn:Ga = 50%:50%), Diameter 50.8*Height 5mm (+/-0.1mm)

Reviews

There are no reviews yet.

Be the first to review “Manganese Gadolinium Sputtering Target”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top