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ST1010 Manganese Oxide Sputtering Target, Mn2O3

TFM offers Manganese Oxide Sputtering Targets with exceptional purity, leveraging extensive expertise in materials science. We provide competitive pricing and customized solutions to meet the most demanding requirements in nanotechnology and thin-film deposition.

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Manganese Oxide Sputtering Target Description

Manganese Oxide Sputtering Targets (Mn₂O₃) are critical materials used in thin film deposition processes. Comprising manganese and oxygen, Mn₂O₃ is known for its distinctive properties that benefit both electronic and optical applications. These sputtering targets support the deposition of thin films with attributes such as high electrical conductivity, optical transparency, and thermal stability. Mn₂O₃ thin films are utilized in various domains, including semiconductor fabrication, solar cells, catalysis, and magnetic storage devices. By offering precise control over film thickness and composition, Manganese Oxide Sputtering Targets (Mn₂O₃) facilitate the production of advanced electronic and optoelectronic components for a wide range of industrial and research purposes.

Related Product: Manganese Sputtering Target, Iron Manganese Sputtering Target

Manganese Oxide Sputtering Target Specifications

Compound FormulaMn2O3
Molecular Weight157.88
AppearanceBlack Target
Melting Point1080℃
Density4.5 g/cm³
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Manganese Oxide Sputtering Target Handling Notes

Indium bonding is recommended for Manganese Oxide Sputtering Targets due to their inherent brittleness and low thermal conductivity, which can present challenges during sputtering. The material’s low thermal conductivity and susceptibility to thermal shock highlight the need for indium bonding to enhance its performance and stability.

Manganese Oxide Sputtering Target Application

Semiconductor Devices: Mn₂O₃ thin films, deposited using sputtering targets, are used in semiconductor manufacturing to produce electronic devices like transistors, capacitors, and diodes. Mn₂O₃ functions as a dielectric material, insulating layer, or barrier film, enhancing the performance and functionality of integrated circuits.

Gas Sensors: Mn₂O₃ films are employed in gas sensing applications to detect gases such as ammonia, hydrogen, and carbon monoxide. These sensors are crucial for environmental monitoring, industrial safety, and automotive exhaust systems due to their high sensitivity and selectivity.

Catalysis: Mn₂O₃ thin films act as catalysts in various chemical reactions, including oxidation, hydrogenation, and decomposition. They are used in industrial processes like fuel production, environmental remediation, and chemical synthesis to improve reaction rates and selectivity.

Transparent Conductive Films: Mn₂O₃ coatings from sputtering targets are used to create transparent conductive films for applications in touchscreens, solar cells, and displays. These films combine electrical conductivity with optical transparency, making them suitable for optoelectronic devices.

Magneto-optical Devices: Mn₂O₃ thin films are utilized in magneto-optical devices to manipulate light based on magnetic fields. They are applied in optical storage systems, magneto-optical data recording, and magnetic sensors for information reading and writing.

Battery Electrodes: Mn₂O₃ serves as an active material in lithium-ion battery cathodes due to its high capacity and stability. Thin films of Mn₂O₃ enable the fabrication of electrodes with enhanced energy storage and cycling performance.

Research and Development: Manganese Oxide Sputtering Targets (Mn₂O₃) are used in research laboratories for thin film deposition studies and material characterization. Researchers investigate the properties of Mn₂O₃ films to develop new technologies and understand their behavior in various environments.

Manganese Oxide Sputtering Target Packaging

Our Manganese Oxide Sputtering Targets are meticulously handled during storage and transportation to ensure they maintain their original quality and condition.

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TFM offers Manganese Oxide Sputtering Targets in a variety of forms, purities, and sizes. We specialize in producing high-purity physical vapor deposition (PVD) materials, ensuring the highest density and smallest average grain sizes. Our targets are designed for use in semiconductor applications, as well as in chemical vapor deposition (CVD) and PVD for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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