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manganeseii-sulfide

VD0822 Manganese(II) Sulfide Evaporation Materials, MnS

Catalog No.VD0822
MaterialManganese Sulfide (MnS)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Manganese(II) sulfide (MnS) evaporation material from TFM is a specialized sulfide ceramic with the chemical formula MnS. This material is vital for high-precision deposition processes, where its high-purity characteristics ensure the production of superior-quality thin films. TFM’s manganese(II) sulfide evaporation materials are crafted to meet stringent purity requirements, providing reliable performance in various industrial applications.

MSDS File

Manganese(II) Sulfide Evaporation Materials Overview

Our manganese(II) sulfide evaporation material, provided by TFM, is a premium ceramic material with the chemical formula MnS. This high-purity material is essential for achieving top-notch film quality in various deposition processes. TFM ensures a purity level of up to 99.9995% through rigorous quality assurance measures, guaranteeing reliable performance.

Specifications

Material TypeManganese(II) sulfide
SymbolMnS
Appearance/ColorRed, green or brown solid
Melting Point1610 ˚C
Density3.99 g/cm
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Manganese(II) sulfide evaporation materials are used in various deposition techniques, including:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are particularly suited for optical applications, including protective coatings, decorative finishes, and display technologies.

Packaging

We ensure that manganese(II) sulfide evaporation materials are meticulously packaged with clear labels for easy identification and quality control. Our packaging process is designed to prevent any damage during storage and transportation.

Contact Us

TFM is a leading supplier of high-purity manganese(II) sulfide evaporation materials, available in multiple forms such as tablets, granules, rods, and wires. Custom options are also available. In addition to evaporation materials, we offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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