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manganese-sputtering-target

ST0029 Manganese Sputtering Target, Mn

Chemical Formula: Mn
Catalog Number: ST0029
CAS Number: 7439-96-5
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Manganese sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Manganese Sputtering Target Description

manganeseThe manganese sputtering target is made from high-purity manganese metal. Manganese, identified by the symbol “Mn” and atomic number 25, is a chemical element that derives its name from the Latin word ‘magnes’ or from ‘magnesia nigra,’ which refers to black magnesium oxide. First noted in 1770 by O. Bergman, manganese was later isolated and its discovery was credited to G. Gahn. This element is situated in Period 4, Group 7 of the periodic table, within the d-block category. The relative atomic mass of manganese is 54.938045(5) Daltons, with the value in parentheses indicating the measurement’s uncertainty.

Manganese Sputtering Target Specification

Material TypeManganese
SymbolMn
Color/AppearanceMetallic Solid
Melting Point1024°C
Density6800 kg/m3
Thermal Conductivity0.165 W/cm/K @ 25 °C
Electrical Resistivity64.0 microhm-cm @ 25°C
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Manganese Sputtering Target Bonding Services

Specialized bonding services for Manganese Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Manganese Sputtering Target Applications

Manganese sputtering targets are widely utilized in thin film deposition for applications such as decoration, semiconductors, displays, LEDs, and photovoltaic devices. They are also essential for functional coatings, optical data storage, and the glass coating industry, including automotive and architectural glass. Additionally, manganese targets find uses in optical communications.

Manganese is a critical alloying element. When added to steel, it enhances qualities such as rolling and forging capabilities, strength, toughness, stiffness, wear resistance, hardness, and hardenability. In aluminum and antimony, manganese can form ferromagnetic compounds, particularly with minor copper additions. Manganese is also known for imparting an amethyst hue to glass.

Manganese Sputtering Target Packaging

Our Manganese Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Manganese Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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