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VD0864A Mercury Telluride Pellet Evaporation Material (HgTe)

MSDS File
Material TypeMercury Telluride
SymbolHgTe
Color/Appearancenear black cubic crystals
Melting Point (°C)673
Theoretical Density (g/cc)8.1
Z Ratio–
E-Beam–
Thermal Evaporation TechniquesBoat:  –
Crucible:  –
E-Beam Crucible Liner Material–
Temp. (°C) for Given Vap. Press. (Torr)–
Comments–

Mercury Telluride Pellet Evaporation Material

TFM offers high-purity Mercury Telluride Pellet Evaporation Material, engineered for thin-film deposition in infrared (IR) detection, optoelectronic, and semiconductor applications. Composed of mercury (Hg) and tellurium (Te), this compound is well known for its narrow bandgap, high carrier mobility, and strong infrared absorption, making it an essential material for infrared sensors, thermal imaging, and optoelectronic devices.

Optimized for thermal evaporation and electron beam (E-beam) evaporation, Mercury Telluride Pellet Evaporation Material ensures precise film uniformity, superior adhesion, and minimal impurity levels for high-performance applications.

Key Features and Advantages

  • Exceptional Infrared Absorption: Ideal for long-wavelength infrared (LWIR) and mid-wavelength infrared (MWIR) detectors.

  • High Carrier Mobility: Enhances signal detection efficiency in optoelectronic and semiconductor devices.

  • Narrow Bandgap Semiconductor: Supports infrared optoelectronics with excellent photoresponse and tunable electrical properties.

  • High Purity & Low Defect Density: Ensures uniform thin-film growth, reducing imperfections and enhancing device performance.

  • Stable Thin-Film Formation: Maintains structural integrity in vacuum deposition environments, ensuring consistent performance in high-tech applications.

Applications

  • Infrared Detectors & Thermal Imaging: Used in night vision systems, IR sensors, and thermal cameras for security, defense, and industrial monitoring.

  • Optoelectronic Devices: Plays a key role in photoelectric conversion, infrared communication, and high-performance imaging systems.

  • Semiconductor & Quantum Devices: Supports research and development in quantum computing, topological insulators, and advanced electronics.

  • Thin-Film Coatings for High-Tech Devices: Essential for precision optical coatings and infrared detection systems.

Industry Impact and Customization

TFM’s Mercury Telluride Pellet Evaporation Material enables advancements in infrared detection, optoelectronics, and semiconductor research, offering custom material compositions to meet specific industry requirements. Our advanced manufacturing techniques ensure high film quality, controlled stoichiometry, and exceptional performance, making it a top choice for cutting-edge thin-film applications.

With its outstanding electrical, optical, and infrared absorption properties, TFM’s Mercury Telluride Pellet Evaporation Material is an essential component for high-performance infrared imaging, semiconductor devices, and quantum research, delivering optimized efficiency and long-term stability.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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