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VD0836 Molybdenum Boride Evaporation Materials, Mo2B5

Catalog No.VD0836
MaterialMolybdenum Boride (Mo2B5)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM excels in manufacturing and supplying premium molybdenum boride evaporation materials. Our high-purity molybdenum boride, along with a diverse range of other evaporation materials, is available in both powder and granule forms. We also offer custom shapes and sizes to meet specific requirements upon request.

Molybdenum Boride Evaporation Materials Overview

Molybdenum boride evaporation materials, identified by the chemical formula Mo2B5, are a specialized ceramic product provided by TFM. These materials are crucial in achieving high-quality thin films during various deposition processes. TFM is committed to delivering molybdenum boride materials with exceptional purity levels of up to 99.9995%, ensuring superior performance and reliability in advanced coating applications.

Specifications of Molybdenum Boride Evaporation Materials

Material TypeMolybdenum Boride
SymbolMo2B5
Appearance/ColorSolid
Melting Point~ 2000 °C (3630 °F)
Density8.65 g/cm3 at 25 °C
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications of Molybdenum Boride Evaporation Materials

Molybdenum boride is widely used in various deposition techniques including semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) processes. It is particularly valuable for creating high-performance optical coatings such as protective layers, decorative finishes, and display technologies.

Packaging and Handling

TFM ensures that molybdenum boride evaporation materials are meticulously packaged to prevent damage during storage and transit. Each package is clearly labeled for easy identification and to facilitate stringent quality control measures.

Contact Us

As a premier supplier of high-purity molybdenum boride evaporation materials, TFM offers a variety of forms including tablets, granules, rods, and wires. We also provide custom solutions to meet specific requirements. In addition to molybdenum boride materials, TFM supplies evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For the latest pricing and further information on our products, please reach out to us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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