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ST0925 Molybdenum Boride Sputtering Target, Mo2B

Chemical FormulaMo2B
Catalog No.ST0925
CAS Number12006-99-4
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Molybdenum Boride Sputtering Target Description

Molybdenum Boride Sputtering Target is used in the sputtering process, a technique for depositing thin films onto substrates. In this process, high-energy ions bombard the target material, causing atoms or molecules to be ejected from the target surface. These ejected particles then deposit onto a substrate, forming a thin film.

Molybdenum Boride Sputtering Targets are commonly used to produce coatings that improve wear resistance, enhance surface durability, and provide specific optical or electrical properties.

Related Product: Molybdenum Boride Sputtering Target (Mo2B5)

Molybdenum Boride Sputtering Target Specifications

Compound FormulaMo2B
Molecular Weight202.69
AppearanceGray target
Melting Point2000
Density (g/cm3)9.2
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Molybdenum Boride Sputtering Target Handling Notes

Indium bonding is recommended for the Molybdenum Boride Sputtering Target due to its characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material has low thermal conductivity and is susceptible to thermal shock, which makes indium bonding a suitable choice to ensure stability and performance during the sputtering process.

Molybdenum Boride Sputtering Target Application

The Molybdenum Boride Sputtering Target is widely used in the production of coatings for tools, electronic devices, and other surfaces where its specific properties, such as enhanced wear resistance and hardness, are desirable.

Molybdenum Boride Sputtering Target Packaging

Our Molybdenum Boride Sputtering Target is widely utilized in the production of coatings for various applications. These include improving the wear resistance of tools, enhancing the durability of surfaces, and providing specific optical or electrical properties.

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TFM offers Molybdenum Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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