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Molybdenum Carbide Evaporation Materials

VD0764 Molybdenum Carbide Evaporation Materials, Mo2C

Catalog No.VD0764
MaterialMolybdenum Carbide (Mo2C)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier provider of high-purity Molybdenum Carbide evaporation materials, renowned for our extensive range of evaporation products. We offer these materials in both powder and granule forms to meet diverse application needs. Additionally, we can supply customized forms tailored to specific requirements upon request.

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Molybdenum Carbide Evaporation Materials

Introduction

Molybdenum Carbide (Mo₂C) evaporation materials are widely used in thin film deposition processes for their exceptional hardness, high melting point, and excellent chemical stability. As a compound material combining molybdenum and carbon, Mo₂C offers a unique combination of metallic and ceramic properties, making it highly valuable in fields that demand wear resistance, thermal stability, and high conductivity.

Detailed Description

Molybdenum Carbide evaporation materials are typically produced through high-temperature synthesis or chemical vapor deposition (CVD), ensuring homogeneity and fine crystalline structure. They possess a melting point around 2,687°C, offering outstanding performance in high-vacuum and high-temperature environments.

Key physical properties include:

  • High hardness and strength: The material’s carbide structure provides superior resistance to mechanical wear and erosion.

  • Excellent electrical and thermal conductivity: Enables uniform film formation and efficient energy transfer during evaporation.

  • Good chemical stability: Resistant to oxidation and corrosion at moderate temperatures, extending its lifespan in demanding environments.

  • Low vapor pressure: Ensures smooth and stable evaporation, preventing contamination during thin film formation.

The material is available in multiple forms such as pellets, granules, pieces, or rods, suitable for both electron-beam and thermal evaporation systems. Custom dimensions and purities (up to 99.9%) can be tailored for different equipment and coating requirements.

Applications

Molybdenum Carbide evaporation materials are used across a wide range of industries and research fields, including:

  • Hard and protective coatings for cutting tools and wear-resistant components

  • Semiconductor and microelectronics thin films

  • Decorative coatings requiring metallic luster and durability

  • Optical coatings and anti-reflective layers

  • Catalytic materials for hydrogen evolution reactions and chemical processing

  • Aerospace and energy systems for high-temperature and high-stress applications

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaMo₂CDefines the stoichiometric composition
Purity99.5% – 99.9%Higher purity improves film uniformity
Melting Point2,687 °CEnables high-temperature stability
Density9.18 g/cm³Affects deposition rate and uniformity
Evaporation SourceE-beam or thermal boatDetermines evaporation method
Particle Size3 – 6 mm (custom)Suitable for crucible loading and even evaporation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Molybdenum Carbide (Mo₂C)High hardness, wear resistanceProtective & electronic coatings
Molybdenum (Mo)High purity, excellent conductivitySemiconductor & optical coatings
Tungsten Carbide (WC)Higher density, extreme wear resistanceIndustrial & decorative coatings

FAQ

QuestionAnswer
Can Molybdenum Carbide evaporation materials be customized?Yes. We can supply in pellet, granule, or custom-shaped pieces according to your system design.
What evaporation methods are compatible?Suitable for both electron-beam and resistive thermal evaporation systems.
Is Mo₂C suitable for reactive deposition?Yes. It can be used in reactive atmospheres such as nitrogen or oxygen depending on the desired compound film.
What is the packaging method?Vacuum-sealed in moisture-proof containers with protective foam to prevent oxidation and contamination.
Which industries most commonly use it?Semiconductor, optical, aerospace, and energy sectors.

Packaging

Our Molybdenum Carbide Evaporation Materials are carefully sealed in vacuum-packed containers with anti-static and anti-corrosive protection. Each batch is clearly labeled with material name, lot number, purity, and weight for full traceability. We ensure safe international shipping with export-compliant packaging.

Conclusion

Molybdenum Carbide evaporation materials combine the durability of ceramics with the conductivity of metals, providing stable and high-quality thin film performance for advanced coating technologies. With customizable sizes and purities, these materials are an excellent choice for demanding deposition applications.

For detailed specifications or quotations, please contact us at [sales@thinfilmmaterials.com].

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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