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ST0225 Molybdenum Carbide Sputtering Target, Mo2C

Chemical Formula: Mo2C
Catalog Number: ST0225
CAS Number: 12069-89-5
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Molybdenum Carbide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Molybdenum Carbide Sputtering Target Description

Molybdenum Carbide sputtering target from TFM is a high-quality carbide ceramic material with the chemical formula Mo2C. This material is widely used in various applications, including thin film deposition and coating technologies, due to its excellent hardness, thermal stability, and resistance to wear and corrosion.

Molybdenum

Molybdenum is a chemical element named after the Greek word ‘molybdos,’ meaning lead. It was first noted in 1778 by W. Scheele, and its isolation was later achieved by J. Hjelm. Represented by the symbol “Mo,” molybdenum has an atomic number of 42. It is located in Period 5, Group 6 of the periodic table, within the d-block. The relative atomic mass of molybdenum is 95.94(2) Dalton, with the value in brackets indicating the measurement uncertainty.

Related Product: Molybdenum Sputtering Target

Carbon

Carbon is a chemical element that originated from the Latin ‘carbo’, meaning charcoal. It was early used in 3750 BC and discovered by Egyptians and Sumerians. “C” is the canonical chemical symbol of carbon. Its atomic number in the periodic table of elements is 6 with a location at Period 2 and Group 14, belonging to the p-block. The relative atomic mass of carbon is 12.0107(8) Dalton, the number in the brackets indicating the uncertainty.

Molybdenum Carbide Sputtering Target Specification

Compound FormulaMo2C
Molecular Weight203.89
AppearanceGray
Melting Point2690 °C
Boiling PointN/A
Density9.18 g/cm3

Molybdenum Carbide Sputtering Target Application

The molybdenum carbide sputtering target is versatile and widely used in several advanced applications:

  1. Thin Film Deposition: Ideal for producing high-performance coatings.
  2. Decoration: Used for decorative coatings that are both durable and aesthetically pleasing.
  3. Semiconductors: Essential in semiconductor device fabrication for its excellent electrical and thermal properties.
  4. Display and LED Devices: Enhances the performance and longevity of display screens and LED lighting.
  5. Photovoltaic Devices: Improves efficiency in solar cells.
  6. Functional Coatings: Applied in various industries for protective and functional layers.
  7. Optical Information Storage: Used in the optical data storage industry, ensuring data integrity and protection.
  8. Glass Coating: Provides protective coatings for automotive and architectural glass.
  9. Optical Communication: Utilized in the coating of components for optical communication systems.

Molybdenum Carbide Sputtering Target Packaging

Our molybdenum carbide sputtering targets are meticulously tagged and labeled externally to guarantee efficient identification and quality control. We take exceptional care in handling and packaging these targets to prevent any damage during storage or transportation, ensuring that they reach you in perfect condition.

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TFM offers Molybdenum Carbide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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